Thermally-expandable solid epoxy resin microcellular foam material and preparation method thereof

Abstract

The invention discloses a thermally-expandable solid epoxy resin microcellular foam material and a preparation method thereof. The foam material is prepared from, by weight, 40-80 parts of solid epoxy resin, 30-50 parts of a curing agent, 3-10 parts of inorganic particles, 0.05-5 parts of a chemical foaming agent, 1-15 parts of a toughening agent and 1-10 parts of reinforced fibers. In the preparation process, a composition is put into a hot press and compacted at the pressure of 10-25 MPa; the composition is put into a foaming mould with a foaming space reserved and subjected to foaming forming for 2-4 h at 90-160 DEG C; then, the temperature is increased to 180-200 DEG C, treatment is carried out for 3 h, and demoulding is carried out after cooling. The foam material has excellent physical and mechanical properties and is easy to process, convenient to store and convey and uniform and regular in cell structure after expansion, and the problems that a solid thermally-expandable material prepared through an existing method is large in cell dimension, difficult to form and process and inconvenient to store are effectively solved.

Description

technical field

[0001] The invention relates to a heat-expandable solid epoxy resin microporous foam material and a preparation method thereof, belonging to the technical development and application field of epoxy resin microporous foam material. Background technique

[0002] Epoxy foam materials have good thermal stability, mechanical properties, insulation properties, heat insulation properties and light weight, etc., and have been widely used in automobiles, electronic potting, aircraft parts, hull shells and other fields. The preparation methods of epoxy foam materials mainly include physical foaming method, chemical foaming method and hollow microsphere curing molding method. The epoxy resin foam material prepared by the above method has larger cell size and fewer cell numbers, which generally cannot meet the requirements of microporous materials.

[0003] Thermally expandable materials can be used in the automotive industry and several other industries. It can be use...

Examples

Embodiment 1

[0021] Take solid powder epoxy composition (40 parts of solid bisphenol A epoxy resin, 20 parts of melamine epoxy resin, 40 parts of anhydride curing agent, 10 parts of nano-montmorillonite, 10 parts of nano-carboxy nitrile glue, N, N' -Dinitrosopentamethylenetetramine 0.6 parts) 35g, compacted at 15MPa, put into a mold with 25% of the foaming space and foam at 110°C, after 4h, raise the oven temperature to 180°C , after 3 hours of heat preservation, naturally cool to room temperature and release the mold to obtain a thermally expandable solid microporous foam material; put the thermally expandable solid material into a 90-degree oven to expand by itself. Setting the mold to have different foaming spaces can prepare thermally expandable solid microcellular foaming materials of different densities, and can also adjust the thermal expansion rate of the material.

[0022] Experimental results: if Figure 1~Figure 2 As shown, after thermal expansion of the heat-expandable solid m...

Embodiment 2

[0025] Get the solid powder epoxy composition (40 parts of solid bisphenol A epoxy resin, 20 parts of solid novolak epoxy resin, 40 parts of anhydride curing agent, 7 parts of nano calcium carbonate, 8 parts of micron nitrile glue, 5 parts of carbon fiber, even Nitrogendiformamide 1.2 parts) 35g, compacted at 15MPa, put into a mold with 10% of the foaming space and foam at 150°C, after 1h, raise the oven temperature to 180°C, keep warm for 3h and then cool naturally to The heat-expandable solid microporous foam material is obtained by demoulding at room temperature; the heat-expandable solid material can be self-expanded in an oven at 110 degrees.

[0026] After testing, the cell diameter and apparent density of the microcellular foamed material prepared in this example before expansion are 30 μm and 1.1 g / cm 3 , the cell diameter and apparent density of the expanded material are 48 μm and 0.3 g / cm respectively 3 .

Embodiment 3

[0028] Get the solid powder epoxy composition (50 parts of solid bisphenol A epoxy resin, 10 parts of solid aliphatic epoxy resin, 40 parts of p-phenylenediamine, 3 parts of zinc oxide, 10 parts of nano carboxylated nitrile glue, short glass fiber 7 parts, sodium bicarbonate 2.4 parts) 35g, compacted at 15MPa, placed in a mold with a foaming space of 10% and foamed at 150°C, after 1h, raise the oven temperature to 180°C, keep warm for 3h and then naturally Cool to room temperature and demould to obtain a heat-expandable solid microporous foam material; put the heat-expandable solid material into a 90-degree oven to expand by itself.

[0029] After testing, the cell diameter and apparent density of the microcellular foamed material prepared in this example before expansion are 30 μm and 1.1 g / cm 3 , the cell diameter and apparent density of the expanded material are 82 μm and 0.16 g / cm respectively 3 .

technical field

[0001] The invention relates to a heat-expandable solid epoxy resin microporous foam material and a preparation method thereof, belonging to the technical development and application field of epoxy resin microporous foam material. Background technique

[0002] Epoxy foam materials have good thermal stability, mechanical properties, insulation properties, heat insulation properties and light weight, etc., and have been widely used in automobiles, electronic potting, aircraft parts, hull shells and other fields. The preparation methods of epoxy foam materials mainly include physical foaming method, chemical foaming method and hollow microsphere curing molding method. The epoxy resin foam material prepared by the above method has larger cell size and fewer cell numbers, which generally cannot meet the requirements of microporous materials.

[0003] Thermally expandable materials can be used in the automotive industry and several other industries. It can be use...

Examples

Embodiment 1

[0021] Take solid powder epoxy composition (40 parts of solid bisphenol A epoxy resin, 20 parts of melamine epoxy resin, 40 parts of anhydride curing agent, 10 parts of nano-montmorillonite, 10 parts of nano-carboxy nitrile glue, N, N' -Dinitrosopentamethylenetetramine 0.6 parts) 35g, compacted at 15MPa, put into a mold with 25% of the foaming space and foam at 110°C, after 4h, raise the oven temperature to 180°C , after 3 hours of heat preservation, naturally cool to room temperature and release the mold to obtain a thermally expandable solid microporous foam material; put the thermally expandable solid material into a 90-degree oven to expand by itself. Setting the mold to have different foaming spaces can prepare thermally expandable solid microcellular foaming materials of different densities, and can also adjust the thermal expansion rate of the material.

[0022] Experimental results: if Figure 1~Figure 2 As shown, after thermal expansion of the heat-expandable solid m...

Embodiment 2

[0025] Get the solid powder epoxy composition (40 parts of solid bisphenol A epoxy resin, 20 parts of solid novolak epoxy resin, 40 parts of anhydride curing agent, 7 parts of nano calcium carbonate, 8 parts of micron nitrile glue, 5 parts of carbon fiber, even Nitrogendiformamide 1.2 parts) 35g, compacted at 15MPa, put into a mold with 10% of the foaming space and foam at 150°C, after 1h, raise the oven temperature to 180°C, keep warm for 3h and then cool naturally to The heat-expandable solid microporous foam material is obtained by demoulding at room temperature; the heat-expandable solid material can be self-expanded in an oven at 110 degrees.

[0026] After testing, the cell diameter and apparent density of the microcellular foamed material prepared in this example before expansion are 30 μm and 1.1 g / cm 3 , the cell diameter and apparent density of the expanded material are 48 μm and 0.3 g / cm respectively 3 .

Embodiment 3

[0028] Get the solid powder epoxy composition (50 parts of solid bisphenol A epoxy resin, 10 parts of solid aliphatic epoxy resin, 40 parts of p-phenylenediamine, 3 parts of zinc oxide, 10 parts of nano carboxylated nitrile glue, short glass fiber 7 parts, sodium bicarbonate 2.4 parts) 35g, compacted at 15MPa, placed in a mold with a foaming space of 10% and foamed at 150°C, after 1h, raise the oven temperature to 180°C, keep warm for 3h and then naturally Cool to room temperature and demould to obtain a heat-expandable solid microporous foam material; put the heat-expandable solid material into a 90-degree oven to expand by itself.

[0029] After testing, the cell diameter and apparent density of the microcellular foamed material prepared in this example before expansion are 30 μm and 1.1 g / cm 3 , the cell diameter and apparent density of the expanded material are 82 μm and 0.16 g / cm respectively 3 .

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