Physical vapor deposition technology applied to communication system assembly for replacing water electroplating

A technology of physical vapor deposition and communication system, which is applied in the field of physical vapor deposition (PVD for short), can solve problems such as no breakthroughs, and achieve the effects of less harmful substances, standardized process flow, and less pollution

Inactive Publication Date: 2016-09-07
SUZHOU COPLATE SURFACE TREATMENT TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, some manufacturers use PVD technology to manufacture coatings, which are applied to other fields and have achieved good social a

Method used

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  • Physical vapor deposition technology applied to communication system assembly for replacing water electroplating

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Embodiment 1

[0036] Embodiment 1: In this embodiment, copper film and silver film are sequentially plated on the filter base material of cast aluminum as an example, and the physical vapor deposition process applied to communication system components instead of water electroplating provided by the present invention is explained as follows:

[0037] Concrete process steps are as follows:

[0038] 1) Degreasing the surface of the workpiece

[0039] Environmentally friendly degreasing liquid degreasing treatment, the temperature of the degreasing liquid is 60°C, and the treatment time is 20 minutes. After degreasing, rinse with tap water;

[0040] 2) Ultrasonic pure water washing

[0041] Contains the following two steps in sequence:

[0042] 1) Ultrasonic cleaning with pure water for 15 minutes at room temperature;

[0043] 2) Ultrasonic cleaning with pure water for 15 minutes at 50°C.

[0044] 3) drying

[0045] The workpiece is dried in an oven at a temperature of 110°C for 30 minutes...

Embodiment 2

[0055] Embodiment 2: In this embodiment, taking copper film and silver film sequentially plated on a machined filter cover plate as an example, the physical vapor deposition coating process applied to communication system components that replaces water electroplating provided by the present invention is explained as follows :

[0056] Concrete process steps are as follows:

[0057] 1) Degreasing the surface of the workpiece

[0058] Sandblasting or brushing treatment first, blown with compressed air, and then rinsed with tap water;

[0059] Then use environment-friendly degreasing liquid to degrease. The temperature of the degreasing liquid is 70°C, and the processing time is 15 minutes. After degreasing, rinse with tap water;

[0060] 2) Ultrasonic pure water washing

[0061] Contains the following two steps in sequence:

[0062] 1) Ultrasonic cleaning with pure water for 20 minutes at room temperature;

[0063] 2) Ultrasonic cleaning with pure water for 10 minutes at 60...

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PUM

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Abstract

The invention discloses a physical vapor deposition technology applied to a communication system assembly for replacing water electroplating. The physical vapor deposition technology comprises the following technological treatment steps of 1, oil dirt removal of the surface of a workpiece, 2, ultrasonic pure water washing, 3, drying, 4, covering, 5, plasma cleaning activation and 6, physical vapor deposition coating. Compared with traditional high-pollution water electroplating, the technology has few generated harmful substances and is basically free of pollution and environment-friendly, standardization and automation are easy to achieve in the technological process, quality is stable, and the film layer performance is improved.

Description

technical field [0001] The invention relates to a physical vapor deposition (referred to as PVD) process applied to communication system components instead of water electroplating. Background technique [0002] The main function of covering the surface of communication system components with copper and silver metal film is to improve the electrical performance of the product. For a long time, the company has been using the traditional water electroplating technology for the metal film coating process on the surface of communication system components, which has been very mature, such as copper plating, nickel plating, silver. The process includes: degreasing, descaling, cleaning, galvanizing, copper electroplating, silver electroplating, post-treatment, drying, etc. Among them, products that require partial electroplating are sprayed with acid and alkali resistant plastic materials, tapes or powder to cover non-plated area. [0003] The impact and hazards of electroplating...

Claims

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Application Information

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IPC IPC(8): C23C14/02C23C14/04C23C14/28C23C14/32C23C14/35C23C14/16
CPCC23C14/021C23C14/022C23C14/042C23C14/165C23C14/28C23C14/325C23C14/352C23C28/023
Inventor 周青松王德苗李劲杰金浩冯斌
Owner SUZHOU COPLATE SURFACE TREATMENT TECH
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