Protective method for grounding grid
A technology for grounding grids and steel wires, applied in coatings, conductive coatings, epoxy resin coatings, etc., can solve problems such as corrosion cracks, reduced leakage capacity of grounding grids, and power failure accidents, and achieve excellent corrosion resistance and extended service life age, the effect of good grounding conductivity
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Embodiment 1
[0017] In this embodiment, the grounding grid is a grounding grid connected by cast copper steel wires; the steel wires are drawn from low-carbon steel with a carbon content of 0.10 wt % through a wire drawing machine. Wherein, the diameter of the steel wire is selected to be 2-12 mm according to the design requirements for the conduction of the main line and the branch line, and the thickness of the cast copper layer outside the steel wire is 0.1-0.2 mm. The cast copper steel wire is dip-plated with a tin coating through a hot-dip tinning process, and an epoxy conductive sealing layer is coated on the tin coating. When hot-dip tinning, the surface of the cast copper wire is first cleaned, and the surface is activated with chloride salt or fluoride salt of alkali metal or alkaline earth metal, and then hot-dip tinning is performed in molten tin liquid. The thickness of the tin plating layer was 20 μm. The thickness of the epoxy conductive sealing layer is 100 μm. The epoxy c...
Embodiment 2
[0019] In this embodiment, the grounding grid is a grounding grid connected by cast copper steel wires; the steel wires are drawn from low-carbon steel with a carbon content of 0.10 wt % through a wire drawing machine. Wherein, the diameter of the steel wire is selected to be 2-12 mm according to the design requirements for the conduction of the main line and the branch line, and the thickness of the cast copper layer outside the steel wire is 0.1-0.2 mm. The cast copper steel wire is dip-plated with a tin coating through a hot-dip tinning process, and an epoxy conductive sealing layer is coated on the tin coating. When hot-dip tinning, the surface of the cast copper wire is first cleaned, and the surface is activated with chloride salt or fluoride salt of alkali metal or alkaline earth metal, and then hot-dip tinning is performed in molten tin liquid. The thickness of the tin coating can be controlled at 20 μm. The thickness of the epoxy conductive sealing layer is 100 μm. ...
Embodiment 3
[0021] In this embodiment, the grounding grid is a grounding grid connected by cast copper steel wires; the steel wires are drawn from low-carbon steel with a carbon content of 0.10 wt % through a wire drawing machine. Wherein, the diameter of the steel wire is selected to be 2-12 mm according to the design requirements for the conduction of the main line and the branch line, and the thickness of the cast copper layer outside the steel wire is 0.1-0.2 mm. The cast copper steel wire is dip-plated with a tin coating through a hot-dip tinning process, and an epoxy conductive sealing layer is coated on the tin coating. When hot-dip tinning, the surface of the cast copper wire is first cleaned, and the surface is activated with chloride salt or fluoride salt of alkali metal or alkaline earth metal, and then hot-dip tinning is performed in molten tin liquid. The thickness of the tin coating can be controlled at 20 μm. The thickness of the epoxy conductive sealing layer is 100 μm. ...
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