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Adhesive tape and preparation method thereof, and component

A tape and glue technology, applied in the direction of adhesives, film/sheet adhesives, etc., can solve problems such as crushing, low efficiency, and poor thermal conductivity of high-molecular polymer substrates

Inactive Publication Date: 2016-10-12
HISENSE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to dissipate the heat from the heat source as soon as possible, there are various heat dissipation methods, among which, the most common one is: connect a heat conduction sheet between the heat sink and the heating part of the electronic component, and the heat conduction sheet transfers the heat in the form of horizontal heat conduction. Pass it out, the efficiency is low, and the heat dissipation effect is not ideal
[0003] In the prior art, there are also people who use heat dissipation tape to dissipate heat from electronic components. The heat dissipation tape is composed of a polymer base material, a heat dissipation coating and a glue layer coated on the base material. However, due to the heat dissipation coating Heat dissipation is usually carried out in the form of heat conduction. The thermal conductivity of polymer substrates is poor, which is not conducive to heat dissipation. In order to improve its heat dissipation performance, researchers compound graphite materials with excellent thermal conductivity and polymer substrates as The base material of heat dissipation tape, however, because graphite itself has a flake structure, it is easy to be crushed or damaged when used as a base material, and the heat dissipation effect needs to be further improved
[0004] Of course, in the prior art, there are still many ways to improve the heat dissipation effect, but the existing methods for improving the heat dissipation effect all stay at the stage of increasing the heat transfer and heat conduction performance, and realizing the seamless contact between the heat dissipation tape and the heating element. In this way, the requirements on the material are higher, and although the thermal conductivity is improved, the heat is easy to accumulate and not easy to dissipate, and the heat dissipation effect is still not ideal.

Method used

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  • Adhesive tape and preparation method thereof, and component

Examples

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preparation example Construction

[0057] In the second aspect, the embodiment of the present invention provides a preparation method of the adhesive tape as described above, see figure 1 ,include:

[0058] Step 1) Mix the heat-dissipating component and the polymer resin in a molten state, and stir to obtain a mixture; the heat-dissipating component includes: nano-silicon carbide and nano-titanium nitride, and the particle size of the nano-silicon carbide is 10- Between 150nm, the particle size of the nano-titanium nitride is between 10-150nm;

[0059] Step 2) processing the mixture into a film;

[0060] Step 3) Coating the glue on the surface of the film and drying to obtain an adhesive tape.

[0061] An embodiment of the present invention provides a method for preparing an adhesive tape. The heat dissipation component and the polymer resin are mixed in a molten state and stirred evenly, so that the heat dissipation component can be uniformly dispersed in the polymer resin, and then Processing into a film c...

Embodiment 1

[0095] Disperse 0.6g of silicon carbide with a diameter of 10nm, 0.4g of titanium nitride with a diameter of 150nm, and 1g of silane coupling agent in 100g of ethyl acetate solvent, stir until the dispersion is uniform, and prepare an inorganic nano heat dissipation component after evaporating the solvent. .

[0096] The PET particles were dried for 8 hours at a temperature of 100° C. and a vacuum of 98 KPa.

[0097] Melt the dried 199g PET resin, add inorganic nano heat dissipation components, mix through a filter and a static mixer, transport it to the machine head by a metering pump, and then cool it into a thick sheet through a quenching roller (the temperature of the conveying section of the extruder 240°C, melting and plasticizing section temperature 285°C, homogenizing section temperature 270°C, filter (network) temperature 285°C, melt line temperature 275°C, cast sheet quenching roll temperature 18°C).

[0098] The PET thick sheet is stretched longitudinally through t...

Embodiment 2

[0103] 18g of silicon carbide with a diameter of 150nm, 4.5g of titanium nitride with a diameter of 10nm, and 7.5g of anatase nano-titanium dioxide with a diameter of 30nm were dispersed in an organic solvent (30g toluene, 40g ethyl acetate, 30g ethylbenzene), After the solvent is volatilized, the inorganic nano heat dissipation particle component is prepared.

[0104] The PET particles were dried for 3 hours at a temperature of 150° C. and a vacuum of 101 KPa.

[0105] Melt the dried 570g PET resin, add inorganic nano heat-dissipating particle components and mix them through a filter and a static mixer, then transport them to the machine head by a metering pump, and then cool them into a thick sheet through a quenching roller (the temperature of the conveying section of the extruder 240°C, melting and plasticizing section temperature 265°C, homogenizing section temperature 270°C, filter (network) temperature 280°C, melt line temperature 270°C, cast sheet quenching roll temper...

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Abstract

The invention relates to the technical field of heat dissipation, particularly an adhesive tape and a preparation method thereof, and a component. The preparation method can enhance the heat dissipation effect and mechanical properties of the adhesive tape. The embodiment of the invention provides an adhesive tape which comprises a film and a glue coating coated on the film surface, wherein the film comprises a polymer resin and a heat dissipation ingredient; the heat dissipation ingredient comprises nano silicon carbide and nano titanium nitride; and the particle size of the nano silicon carbide is 10-150nm, and the particle size of the nano titanium nitride is 10-150nm.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to an adhesive tape, a preparation method and components thereof. Background technique [0002] With the rapid development of science and technology, the density and miniaturization of integrated circuits is getting higher and higher, and electronic components become smaller and run at higher speeds, making their requirements for heat dissipation increasingly higher. In order to dissipate the heat from the heat source as soon as possible, there are various heat dissipation methods, among which, the most common one is: connect a heat conduction sheet between the heat sink and the heating part of the electronic component, and the heat conduction sheet transfers the heat in a horizontal heat conduction way. Pass it out, the efficiency is low, and the heat dissipation effect is not ideal. [0003] In the prior art, there are also people who use heat dissipation tape to dissipa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02
CPCC08K3/28C08K3/34C08K2003/2241C08K2201/003C08K2201/011C09J7/22C09J2203/326C09J2301/302C09J2301/312C09J2301/408C09J2301/41
Inventor 邢哲
Owner HISENSE