A double-layer through-hole printed circuit board with silver paste through-holes and its manufacturing process

A printed circuit board and through-hole technology, which is applied to printed circuits, printed circuits, printed circuit components, etc., can solve the problems of silver paste migration, insulation resistance drop, etc., to suppress migration, suppress ionization, and improve stability sexual effect

Inactive Publication Date: 2018-09-18
LINAN SHENGDA ELECTRONICS FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, the object of the present invention is to aim at the defects and deficiencies of the prior art, to provide a double-layer through-hole printed circuit board with silver paste through-holes and its manufacturing process with simple structure and process, which solves the problems caused by temperature in the prior art. , The migration phenomenon caused by humidity to the silver paste, avoiding the problem of the resistance drop of the insulation resistance caused by this problem

Method used

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  • A double-layer through-hole printed circuit board with silver paste through-holes and its manufacturing process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] (1) The surface modification solution is prepared according to the following raw materials in parts by weight: methyltriacetoxysilane 50, zinc acetate 5, stearic monoglyceride 3;

[0028] (2) Immerse the double-layer through-hole printed circuit board with multiple through-holes in the surface modification solution for 2 hours of ultrasonic vibration, and then take it out and dry it in vacuum at 80°C for 5 hours to obtain the double-layer through-hole printed circuit board after surface modification. circuit board;

[0029] (3) Take tolyl cyclohexanone 12, glyceryl tristearate 8, orthosilicate 5, phytic acid ester 4, aminopropyl triethoxysilane 4, methyl isobutyl Ketone 15, mixing the above-mentioned organic matter to obtain a mixed solution, adding silicon dioxide 5, nickel acetate 7 with an average particle diameter of 100nm, magnesium oxide 5 with an average particle diameter of 100nm, and nano-silver powder with an average particle diameter of 50nm in the above-ment...

Embodiment 2

[0034] (1) The surface modification solution is prepared according to the following raw materials in parts by weight: 60 methyltriacetoxysilane, 10 zinc acetate, 8 monoglyceride stearate;

[0035] (2) Immerse the double-layer through-hole printed circuit board with multiple through-holes in the surface modification solution for 5 hours of ultrasonic vibration, and then take it out and dry it in vacuum at 100°C for 2 hours to obtain the surface-modified double-layer through-hole printed circuit board ;

[0036] (3) Take tolyl cyclohexanone 19, glyceryl tristearate 15, tetraethyl orthosilicate 9, phytic acid ester 8, aminopropyl triethoxysilane 6, methyl isobutyl Ketone 22, mixing the above organic matter to obtain a mixed solution, adding 200nm silicon dioxide 13, nickel acetate 12, 500nm magnesium oxide 10, and 100nm silver powder 80 to the above mixed solution according to parts by weight, and stirring evenly to obtain a silver paste;

[0037] (4) Fill the silver paste into ...

Embodiment 3

[0040] (1) The surface modification solution is prepared according to the following raw materials in parts by weight: methyltriacetoxysilane 55, zinc acetate 8, stearic acid monoglyceride 5;

[0041] (2) Immerse the double-layer through-hole printed circuit board with multiple through-holes in the surface modification solution for 3 hours and ultrasonically vibrate for 3 hours, then take it out and dry it in vacuum at 60°C for 6 hours to obtain the surface-modified double-layer through-hole printed circuit board ;

[0042] (3) Take tolyl cyclohexanone 15, glyceryl tristearate 12, tetraethyl orthosilicate 6, phytic acid ester 7, aminopropyl triethoxysilane 5, methyl isobutyl Ketone 19, mixing the above organic matter to obtain a mixed solution, adding 50nm silicon dioxide 11, nickel acetate 10, 60nm magnesium oxide 7, and 20nm silver powder 75 to the above mixed solution according to parts by weight, and stirring evenly to obtain a silver paste;

[0043] (4) Fill the silver pa...

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PUM

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Abstract

The invention discloses a dual-layer through hole printed circuit board with silver paste through holes and a manufacturing technology of the dual-layer through hole printed circuit board. The dual-layer through hole printed circuit board comprises an upper circuit layer, a lower circuit layer and a plurality of through holes, wherein the plurality of through holes penetrate through the upper circuit layer and the lower circuit layer along the upper-lower direction; the plurality of through holes are filled with silver paste; the upper circuit layer and the lower circuit layer are electrically connected through a silver paste through hole technology; and the upper circuit layer, the lower circuit layer and the through holes are subjected to surface modification treatment before the silver paste through hole technology is carried out. The surface treatment and the silver paste play a cooperative role; the stability of the silver paste is improved; and silver ion migration is effectively inhibited.

Description

technical field [0001] The invention relates to a double-layer through-hole printed circuit board and a manufacturing process thereof, in particular to a double-layer through-hole printed circuit board with silver paste through-holes and a manufacturing process thereof. Background technique [0002] The printed circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances. The printed circuit board can be called a printed circuit board, and the English name is Printed Circuit Board (PCB). Printed circuit boards are the providers of electrical connections for electronic components. Its development has a history of more than 100 years; its design is mainly layout design; the main advantage of using circuit boards is that it greatly reduces wiring and assembly errors, and improves automation and production labor rates. [0003] Such as figure 1 As shown, silver p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K3/42
CPCH05K1/115H05K3/42H05K2201/09563
Inventor 肖绍海邓金甫林卫权毛立成
Owner LINAN SHENGDA ELECTRONICS FACTORY
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