Single-face shadow eliminating conductive glass and processing method thereof

A conductive glass and processing method technology, applied in the direction of chemical instruments and methods, glass/slag layered products, electronic equipment, etc., can solve the problems of viewing patterns, affecting electromagnetic shielding, electrostatic protection functions, etc., to achieve simple structure and low cost Low, good electromagnetic shielding effect

Inactive Publication Date: 2016-10-26
东莞汇海光电科技实业有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the production process, it is easy to etch away parts that should not be etched, and there are traces of circuit etching, which affect its electromagnetic shielding and electrostatic protection functions. The existing traces of etch will affect the viewing pattern

Method used

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  • Single-face shadow eliminating conductive glass and processing method thereof

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Embodiment Construction

[0022] The present invention will be described below in conjunction with specific embodiments.

[0023] Such as figure 1 As shown, a single-sided shadow-eliminating conductive glass includes a glass substrate 1, a tin surface 2, an interference layer 3, a transparent passivation layer 4, and an ITO film 5. The upper and lower surfaces of the glass substrate 1 are provided with a tin surface 2, and the glass substrate 1 An interference layer 3 is provided above the tin surface 2 on the upper surface, a transparent passivation layer 4 is provided above the interference layer 3, an ITO mold 5 is provided above the transparent passivation layer 4, and an ITO mold 5 is provided below the tin surface 2 on the lower surface of the glass substrate 1. Film 5.

[0024] As preferred in this embodiment, the interference layer 3 is titanium dioxide.

[0025] As preferred in this embodiment, the transparent passivation layer 4 is silicon dioxide.

[0026] Furthermore, preferably in this ...

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Abstract

The invention discloses single-face shadow eliminating conductive glass and a processing method thereof. The single-face shadow eliminating conductive glass comprises a glass substrate, tin surfaces, an interference layer, a transparent passivation layer and ITO (indium tin oxide) films. Upper and lower surfaces of the glass substrate are provided with the tin surfaces, the interference layer, the transparent passivation layer and one of the ITO films are arranged above the tin surface of the upper surface of the glass substrate sequentially from bottom to top, and the other ITO film is arranged below the tin surface of the lower surface of the glass substrate. The processing method of the single-face shadow eliminating conductive glass includes: step one, cleaning and heating the glass substrate, wherein a heating temperature is 40-60 DEG C; step two, forming the interference layer, the transparent passivation layer and the ITO film on the tin surface of the upper surface of the glass substrate by sputtering; step three, forming the other ITO film on the tin surface of the lower surface of the glass substrate by sputtering. The single-face shadow eliminating conductive glass has advantages of simple structure, low cost and effectiveness in electromagnetic shielding, electrostatic protection and shadow elimination.

Description

technical field [0001] The invention relates to the technical field of conductive glass, in particular to a single-sided shadow-eliminating conductive glass and a processing method thereof. Background technique [0002] At present, capacitive screen products are widely used, and the double-sided conductive glass in the capacitive screen is its main component. The conductive film coated with conductive glass on both sides has relatively strict performance requirements, such as uniformity, heat resistance, acid and alkali resistance. Performance, high temperature and high humidity resistance, etc.; when making transparent circuits, due to the increased process difficulty, acid engraved circuits are often used when making circuits. During the production process, it is easy to etch away parts that should not be etched, and there are traces of circuit etching, which affect its electromagnetic shielding and electrostatic protection functions, and the existing traces of etch will a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/06B32B15/04B32B9/04B32B38/16B32B37/06C23C14/34C23C14/08C23C14/10C23C14/58
CPCB32B17/061B32B9/04B32B15/04B32B37/06B32B38/162B32B2255/20B32B2307/21B32B2307/212B32B2457/00C23C14/083C23C14/086C23C14/10C23C14/34C23C14/5806
Inventor 严爱平余松霖
Owner 东莞汇海光电科技实业有限公司
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