Single-face shadow eliminating conductive glass and processing method thereof
A conductive glass and processing method technology, applied in the direction of chemical instruments and methods, glass/slag layered products, electronic equipment, etc., can solve the problems of viewing patterns, affecting electromagnetic shielding, electrostatic protection functions, etc., to achieve simple structure and low cost Low, good electromagnetic shielding effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2016-10-26
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1
Abstract
Description
technical field
[0001] The invention relates to the technical field of conductive glass, in particular to a single-sided shadow-eliminating conductive glass and a processing method thereof. Background technique
[0002] At present, capacitive screen products are widely used, and the double-sided conductive glass in the capacitive screen is its main component. The conductive film coated with conductive glass on both sides has relatively strict performance requirements, such as uniformity, heat resistance, acid and alkali resistance. Performance, high temperature and high humidity resistance, etc.; when making transparent circuits, due to the increased process difficulty, acid engraved circuits are often used when making circuits. During the production process, it is easy to etch away parts that should not be etched, and there are traces of circuit etching, which affect its electromagnetic shielding and electrostatic protection functions, and the existing traces of etch will a...
Examples
Embodiment Construction
[0022] The present invention will be described below in conjunction with specific embodiments.
[0023] Such as figure 1 As shown, a single-sided shadow-eliminating conductive glass includes a glass substrate 1, a tin surface 2, an interference layer 3, a transparent passivation layer 4, and an ITO film 5. The upper and lower surfaces of the glass substrate 1 are provided with a tin surface 2, and the glass substrate 1 An interference layer 3 is provided above the tin surface 2 on the upper surface, a transparent passivation layer 4 is provided above the interference layer 3, an ITO mold 5 is provided above the transparent passivation layer 4, and an ITO mold 5 is provided below the tin surface 2 on the lower surface of the glass substrate 1. Film 5.
[0024] As preferred in this embodiment, the interference layer 3 is titanium dioxide.
[0025] As preferred in this embodiment, the transparent passivation layer 4 is silicon dioxide.
[0026] Furthermore, preferably in this ...