Nanosized silicon nitride reinforced aluminium-magnesium alloy material for automobile electronic packaging and preparation method of alloy material

A nano-silicon nitride, automotive electronics technology, applied in the field of electronic packaging materials, can solve the problems of alloy material strength, plasticity reduction, unsatisfactory nano-material dispersion in alloys, limited application range, etc. Thermal shock performance, excellent encapsulation effect, stable and long-lasting performance

Inactive Publication Date: 2016-10-26
ANHUI KING AUTO ELECTRONICS TECH CO LTD
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The article "Preparation of Diamond/Al-Cu-based Composite Materials by Vacuum Hot Pressing Sintering Method" uses vacuum hot pressing sintering to improve the adverse reaction of the interface between diamond and aluminum, and at the same time adds Cu powder to improve the performance. This method uses micron-sized diamonds Powder, although

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[0015] A nano silicon nitride reinforced aluminum-magnesium alloy material for automotive electronic packaging, the alloy material is made of the following parts by weight of raw materials: magnesium 6%, zinc 4%, copper 2%, yttrium 1%, nickel-coated molybdenum disulfide powder 1%, 40% nano-silica nitride sol, 1% pore former, 0.5 anhydrous ethanol, the balance is aluminum.

[0016] The nano silicon nitride sol is prepared by the following method: put dodecyltrimethylammonium bromide into absolute ethanol, stir until it is completely dissolved, put into nano silicon nitride, and ultrasonically oscillate and disperse for 5 hours to obtain; The weight ratio of nano silicon nitride, absolute ethanol, and dodecyltrimethylammonium bromide is 1:5:0.1.

[0017] The pore former is one of spherical urea.

[0018] The preparation method of the alloy material includes the following steps:

[0019] (1) First, mix aluminum, magnesium, zinc, copper, yttrium, nickel-coated molybdenum disulfide powder...

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Abstract

The invention discloses a nanosized silicon nitride reinforced aluminium-magnesium alloy material for automobile electronic packaging. The nanosized silicon nitride reinforced aluminium-magnesium alloy material for the automobile electronic packaging is produced by the following raw materials, in parts by weight, 6-8% of magnesium, 4-5% of zinc, 2-3% of copper, 1-2% of yttrium, 1-2% of nickel-coated molybdenum disulfide powders, 40-50% of nanosized silicon nitride sol, 1-2% of pore-forming agent and 0.5-1% of absolute ethyl alcohol, with the balance being aluminium.

Description

technical field [0001] The invention relates to the technical field of electronic packaging materials, in particular to a nano-silicon nitride reinforced aluminum-magnesium alloy material for automotive electronic packaging and a preparation method thereof. Background technique [0002] Automotive electronics is the general term for automotive electronic control devices and on-board automotive electronic devices. Automotive electronics occupy a vital position in automotive technology and are the most important technical measures for developing new models and improving automotive performance. Due to the extreme operating temperature range, strong mechanical vibration, and many stains inside the car, to ensure that the performance of automotive electronic products will not be disturbed, it is necessary to do a good job in product packaging and select good packaging materials to achieve a better industry. Low cost, stronger functions, higher reliability and other technological ...

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Application Information

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IPC IPC(8): C22C21/00C22C32/00C22C1/10
CPCC22C1/1026C22C21/00C22C32/0047
Inventor 王进
Owner ANHUI KING AUTO ELECTRONICS TECH CO LTD
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