Silver salt doped silver conductive adhesive, as well as preparation method and application thereof

Abstract

The invention provides a silver salt doped silver conductive adhesive, as well as a preparation method and application thereof. The silver salt doped silver conductive adhesive is prepared from the following raw materials in parts by weight: 0.01 to 5 parts of silver salt, 50 to 85 parts of micron silver powder, 10 to 50 parts of epoxy resin, 0.5 to 60 parts of a curing agent, 0.05 to 5 parts of an accelerator, 0.05 to 5 parts of a coupling agent, 1 to 10 parts of a diluent and 0.05 to 2 parts of an anti-precipitant. According to the preparation method, the silver salt is introduced into the formula of the silver conductive adhesive in a doping manner, so that the using amount of the silver powder can be reduced by 15 to 20 percent on the premise of ensuring the conductivity of the silver conductive adhesive; under the same addition of the silver powder, the electrical conductivity of the silver conductive adhesive is greatly improved, and moreover, the silver conductive adhesive has strong shear strength and high aging resistance; the prepared silver salt doped silver conductive adhesive can be widely applied to the fields of solar cell, IC (integrated circuit) and LED (light-emitting diode) packaging and the like.

Description

technical field [0001] The invention relates to a conductive silver glue doped with silver salt, a preparation method and application thereof, and belongs to the technical field of semiconductor materials and preparation thereof. Background technique [0002] As a substitute for traditional packaging materials in the field of electronic packaging—solder, conductive adhesive has many advantages, such as: environmental friendliness, no toxic metals, no need for pre-cleaning and post-soldering cleaning in the process; mild curing temperature, greatly reducing the impact on electronic devices Thermal damage and internal stress, especially suitable for heat-sensitive materials and non-solderable materials; high line resolution, and its line resolution below 200μm is more suitable for fine-pitch manufacturing. The many advantages of conductive adhesives adapt to the development trend of miniaturization, lightness and integration of electronic devices today, so it is widely used in...

AI Technical Summary

Problems solved by technology

[0008] Therefore, in view of the relatively low electrical conductivity, poor cohesiveness, and high cost of the current conductive silver glue, it has become a priority to develop a relatively high electrical conductivity, strong cohesive and low-cost conductive silver glue. Technical problems that need to be solved urgently

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