BDADDM-type siliceous epoxy imide matrix resin and preparation method thereof

A technology of silicon epoxy imide matrix and epoxy resin, which is applied in the field of polymer matrix resin and its preparation, can solve problems such as unsatisfactory heat resistance, achieve good industrialization prospects, excellent comprehensive performance, and realize industrialized production Effect

Inactive Publication Date: 2016-11-16
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its heat resistan

Method used

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  • BDADDM-type siliceous epoxy imide matrix resin and preparation method thereof
  • BDADDM-type siliceous epoxy imide matrix resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] 73.2 grams (0.2 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 735.0 grams of o-cresol, 52.0 grams (0.1 moles) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 3.8 grams of isoquinoline dropwise, heat to 100°C, stir and react for 5 hours, then cool to 60°C, pour the reactant into a precipitate containing 1500 grams of methanol Stir in the kettle at high speed to precipitate solid matter, filter, and vacuum-dry at 80°C for 10 hours to obtain 308.3 g of imide oligomer (theoretical yield: 314.0 g), with a yield of 98.2%, which is designated as BBMO-1.

Embodiment 2

[0046] 73.2 g (0.2 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 1460 g of o-cresol, 52.0 g (0.1 mol) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 14.0 grams of isoquinoline dropwise, heat to 110°C, stir and react for 12 hours, cool to 60°C, pour the reactant into 2000 grams of ethanol and 920 grams of In the settling tank of ethylene glycol monomethyl ether, high-speed stirring, the solid matter was precipitated, filtered, and vacuum-dried at 80°C for 10 hours to obtain 313.4 grams of imide oligomers (theoretical yield: 314.0 grams), with a yield of 99.8%. Denoted as BBMO-2.

Embodiment 3

[0048]1.0 g of 4,4'-bis(2,4-diaminophenoxy)diphenylmethane (BDADDM), 10.0 g of N,N,N',N',O,O'-hexaglycidyl-2 , 2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane epoxy resin, 10.0 g N,N,N',N'-tetraglycidyl-1,4-bis(4-aminophenoxy Base) benzene epoxy resin, 10.0 grams of 4,5-epoxycyclohexane-1,2-dicarboxylate diglycidyl epoxy resin, 25.0 grams of CE793 epoxy resin and 45.0 grams of N,N,N',N '-Tetraglycidyl-2,2-bis[4-(4-aminophenoxy)phenyl]propane epoxy resin was put into the reaction kettle, stirred and mixed for 0.5 hours at 100°C, and then 2.0 g of BBMO was added -1 imide oligomer continued to stir and react for 1 hour, then added 3.0 grams of 3-aminopropyltrimethoxysilane and stirred for 5 minutes, cooled to room temperature, and then added 18.0 grams of 1,8-diaza-bicyclo[ 5.4.0] Undecene-7 and 32.0 grams of methyltetrahydrophthalic anhydride were stirred and mixed uniformly to obtain 156.0 grams of BDADDM type silicon-containing epoxyimide matrix resin, denoted as M-1.

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Abstract

The invention relates to BDADDM-type siliceous epoxy imide matrix resin and a preparation method thereof. The matrix resin is prepared from 4,4'-bis(2,4-diaminophenoxy)diphenylmethane BDADDM, epoxy resin, 3-aminopropyl trialkoxysilane, an imide oligomer and a curing agent. The preparation method comprises the following steps: (1) preparing the imide oligomer; (2) putting 4,4'-bis(2,4-diaminophenoxy)methane and the epoxy resin into a reactor, carrying out a hybrid reaction with stirring, then, adding the imide oligomer, continuing to carry out a reaction with stirring, then, adding the 3-aminopropyl trialkoxysilane, carrying out a reaction with stirring, then, adding the curing agent, and carrying out stirring and uniform mixing, thereby preparing the matrix resin. The matrix resin can be extensively applied to the bonding of metals such as steel, copper and aluminum and among substrates such as ceramics, glass and resin-based composite materials and the preparation of glass fibers, aramid fibers and carbon fiber reinforced composite materials, thereby having a good industrialized foreground.

Description

technical field [0001] The invention belongs to the field of polymer matrix resin and its preparation, in particular to a BDADDM silicon-containing epoxyimide matrix resin and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: ring The cur...

Claims

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Application Information

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IPC IPC(8): C08G59/50C08G73/10
CPCC08G59/50C08G59/5033C08G59/504C08G73/106
Inventor 虞鑫海吴倩周志伟
Owner DONGHUA UNIV
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