Backdrilling plug hole panel and machining method thereof

A processing method and back-drilling technology, which are applied in the field of back-drilling plug hole plates and their processing, can solve the problem of easy generation of voids in back-drilling, and achieve the effects of reducing voids, reducing the probability of occurrence, and avoiding voids.

Active Publication Date: 2016-11-16
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] In addition, in the actual processing process, back-drilled holes in isolated positions are more likely to produce voids than back-drilled holes in dense positions

Method used

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  • Backdrilling plug hole panel and machining method thereof
  • Backdrilling plug hole panel and machining method thereof
  • Backdrilling plug hole panel and machining method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] A method for processing a back-drilled plug orifice plate, comprising the following steps:

[0050] 1) Plating holes after back-drilling; back-drilling the metallized holes on the substrate, the back-drilled section is a non-metallized hole, the remaining section maintains the metallization feature, and the metallized hole is thickened with copper plating; the structure of the substrate is as follows figure 2 As shown, there is an edge banding area 101 outside the graphic area 203, and a back-drilled position through hole 202 is provided in the graphic area, including dense back-drilled holes 201 and isolated back-drilled holes 204, wherein the isolated back-drilled holes include small back-drilled holes 211 and large back drilling 212; in step 1), an auxiliary hole 102 is provided in the edge banding area; the auxiliary hole is a non-metallized hole, the diameter of the auxiliary hole is 0.9mm, and the hole spacing is 15mm;

[0051] 2) Baking board: bake the board at ...

Embodiment 2

[0056] A method for processing a back-drilled plug orifice plate, comprising the following steps:

[0057]1) Back-drilling and plating holes; back-drilling the metallized holes on the substrate, the back-drilled section is a non-metallized hole, the remaining section maintains the metallization feature, and the metallized hole is thickened with copper plating;

[0058] 2) Baking board: bake the board at 160°C; for substrates with water absorption > 0.1%, bake the board for 6 hours; for substrates with water absorption ≤ 0.1%, bake the board for 4 hours.

[0059] 3) Plug hole: use resin to fill the back drilled hole;

[0060] 4) Curing: Curing the resin filling the back-drilled holes at 160°C for 60 minutes.

[0061] The back-drilled plug orifice plate processed in this embodiment has no visible void in the back-drilled plug hole.

Embodiment 3

[0063] A method for processing a back-drilled plug orifice plate, comprising the following steps:

[0064] 1) Back-drilling and plating holes; back-drilling the metallized holes on the substrate, the back-drilled section is a non-metallized hole, the remaining section maintains the metallization feature, and the metallized hole is thickened with copper plating;

[0065] 2) Baking board: bake the board at 140°C; for substrates with water absorption > 0.1%, bake the board for 8 hours; for substrates with water absorption ≤ 0.1%, bake the board for 6 hours.

[0066] 3) Plug hole: use resin to fill the back drilled hole;

[0067] 4) Curing: Curing the resin filling the back-drilled holes at 140°C for 40 minutes.

[0068] The back-drilled plug orifice plate processed in this embodiment has no visible void in the back-drilled plug hole.

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PUM

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Abstract

The invention discloses a backdrilling plug hole panel and a machining method thereof. Particularly, the machining method of the backdrilling plug hole panel comprises the following steps of (1) hole plating after backdrilling: carrying out backdrilling on plated through holes in a substrate, wherein a backdrilling segment is a non-plated through hole, and a remaining segment keeps the metallization characteristic; and carrying out thickening and copper plating on the plated through holes; (2) panel baking: baking the panel at 120-160 DEG C; (3) hole plugging: filling backdrilling holes with resin; and (4) solidification: carrying out solidification treatment on the resin for filling the backdrilling holes. According to the machining method, the moisture content of the substrate can be effectively reduced through panel baking before hole plugging, so that a cavity can be effectively avoided in resin hole plugging.

Description

technical field [0001] The invention relates to the technical field of resin plug holes, in particular to a back-drilled plug hole plate and a processing method thereof. Background technique [0002] In the resin plugging process of PCB, there are two methods: traditional screen printing plugging with window opening and plugging with vacuum plugging machine. In the process of processing, the circuit board must be soaked in aqueous solution tanks such as copper sinking and electroplating, or go through other washing processes. During this process, the epoxy material of the circuit board will absorb moisture, which may affect the yield of back-drilled plug holes. After the back-drilled resin plug holes, resin overflow will easily occur when the baking plate is cured, which will seriously affect the graphic layout of the surface layer of the back-drilled hole. There is a phenomenon of mounting virtual soldering and so on. [0003] In actual production, the water absorption r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0094H05K3/42H05K2201/0959
Inventor 范红王红飞陈蓓
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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