High-temperature adhesive tape solder preparation device and method

A technology for preparing device and adhesive tape, which is applied to manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of insufficient strength, long production cycle of adhesive tape brazing material, difficult operation, etc. Continuous production, thickness can be adjusted arbitrarily

Inactive Publication Date: 2016-11-23
ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the convenience of use, these alloy powders (-100 mesh ~ 800 mesh) are usually mixed with various binders to make paste solder, and then the paste solder is applied to the waiting However, for parts with special structures such as honeycomb and irregular contact surfaces, these solder preset methods have disadvantages such as difficult operation and low efficiency.
[0003] In order to solve the above problems, it

Method used

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  • High-temperature adhesive tape solder preparation device and method

Examples

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Example Embodiment

[0027] Example 1

[0028] To prepare a nickel-based high temperature adhesive tape solder with a thickness of 2.0mm, the operation steps are as follows:

[0029] (1) Take 170g of binder and 830g of nickel-based high temperature solder powder with mesh number of -100~800, mix and stir evenly to form a paste;

[0030] (2) Pour the paste into the extruding cylinder of the extruder, and install the needle;

[0031] (3) Adjust the roll spacing to 2.2mm;

[0032] (4) Start the preparation device, adjust the speed of the rolls, the release paper tray, the take-up tray and the rolls operate synchronously, pass the upper and lower release papers through the gap between the rolls, and then wind them on the take-up tray;

[0033] (5) Start the extruder and extrude the strip paste on the center line of the lower release paper. The strip paste is formed into a strip of solder under the co-extrusion action of the release paper and the roller, and then collected in the receiving material Intraday

[00...

Example Embodiment

[0036] Example 2

[0037] To prepare a copper-based high temperature adhesive tape solder with a thickness of 1.5mm, the operation steps are as follows:

[0038] (1) Take 130g of binder and 870g of copper-based high temperature solder powder with a mesh number of -150~800, mix and stir evenly to form a paste;

[0039] (2) Pour the paste into the extruding cylinder of the extruder, and install the needle;

[0040] (3) Adjust the roll spacing to 1.7mm;

[0041] (4) Start the preparation device, adjust the speed of the rolls, the release paper tray, the take-up tray and the rolls operate synchronously, pass the upper and lower release papers through the gap between the rolls, and then wind them on the take-up tray;

[0042] (5) Start the extruder and extrude the strip paste on the center line of the lower release paper. The strip paste is formed into a strip of solder under the co-extrusion action of the release paper and the roller, and then collected in the receiving material Intraday

[...

Example Embodiment

[0045] Example 3

[0046] To prepare a cobalt-based high-temperature adhesive tape solder with a thickness of 1.0mm, the operation steps are as follows:

[0047] (1) Take 70g of binder and 930g of cobalt-based high-temperature solder powder with mesh number of -325~800, mix and stir evenly to form a paste;

[0048] (2) Pour the paste into the extruding cylinder of the extruder, and install the needle;

[0049] (3) Adjust the roll spacing to 1.2mm;

[0050] (4) Start the preparation device, adjust the speed of the rolls, the release paper tray, the take-up tray and the rolls operate synchronously, pass the upper and lower release papers through the gap between the rolls, and then wind them on the take-up tray;

[0051] (5) Start the extruder and extrude the strip paste on the center line of the lower release paper. The strip paste is formed into a strip of solder under the co-extrusion action of the release paper and the roller, and then collected in the receiving material Intraday

[005...

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Abstract

The invention discloses a high-temperature adhesive tape solder preparation device and method. The preparation device comprises release paper trays 1, a material extruding machine 2, a roller rolling machine 3 and a material collecting disc 4. The preparation method comprises the following steps: firstly mixing a high-temperature welding powder and an adhesive to form a paste; secondly loading the paste into the material extruding machine 2 and extruding strip-shaped paste on a release paper by the material extruding machine 2, rolling the mixed paste isolated by the release paper by the roller rolling machine 3, and finally placing the material collecting disc 4 which has collected the strip-shaped solder in a constant-temperature drying chamber provided with ventilation facilities, and carrying out drying treatment. According to the invention, the extrusion action force of the double-roller rolling mill is utilized, so that the mixed paste of the adhesive and the high-temperature welding powder flows in the two-dimensional space of the release paper, the gap and the rotating speed of the roller are controlled to obtain the high-temperature adhesive tape solder which is flat in surface, compact in the overall density and uniform in thickness. The method is simple and easy to operate and the industrial production is easy to achieve.

Description

technical field [0001] The invention relates to the technical field of brazing material processing, in particular to a device and method for preparing high-temperature adhesive tape brazing material. Background technique [0002] High-temperature solders such as nickel-based, cobalt-based, manganese-based and copper-based, etc., usually add silicon, boron, phosphorus and other elements to form binary or multi-element alloys in order to achieve the purpose of lowering the melting point. These alloys generally have greater brittleness and do not It can be processed into filaments, strips, flakes and other shapes, and it is only used in powder state. For the convenience of use, these alloy powders (-100 mesh ~ 800 mesh) are usually mixed with various binders to make paste solder, and then the paste solder is applied to the waiting However, for parts with special structures such as honeycomb and irregular contact surfaces, these solder preset methods have disadvantages such as ...

Claims

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Application Information

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IPC IPC(8): B23K35/40B23K35/14
CPCB23K35/40B23K35/0227
Inventor 经敬楠金霞张玉石磊顾小龙
Owner ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL
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