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BAHPEP type silicon-containing epoxy imide matrix resin and preparation method thereof

A technology of silicon epoxy imide matrix and epoxy resin, which is applied in the field of polymer matrix resin and its preparation, can solve problems such as unsatisfactory heat resistance, achieve good industrialization prospects, realize industrialized production, and be environmentally friendly. Effect

Inactive Publication Date: 2016-11-23
DONGHUA UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its heat resistance is not ideal enough

Method used

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  • BAHPEP type silicon-containing epoxy imide matrix resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] 73.2 grams (0.2 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 735.0 grams of o-cresol, 52.0 grams (0.1 moles) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 3.8 grams of isoquinoline dropwise, heat to 100°C, stir and react for 5 hours, then cool to 60°C, pour the reactant into a precipitate containing 1500 grams of methanol Stir in the kettle at high speed to precipitate solid matter, filter, and vacuum-dry at 80°C for 10 hours to obtain 308.3 g of imide oligomer (theoretical yield: 314.0 g), with a yield of 98.2%, which is designated as BBMO-1.

Embodiment 2

[0046] 73.2 g (0.2 mol) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (BAHPFP, 366 g / mol), 1460 g of o-cresol, 52.0 g (0.1 mol) of 2,2- Bis[4-(3,4-dicarboxyphenoxy)phenyl]propanedianhydride (BPADA, 520g / mol) and 19.6 grams (0.2mol) of maleic anhydride (MA, 98g / mol) were placed in the reactor , feed nitrogen, stir, heat up to 80°C, add 14.0 grams of isoquinoline dropwise, heat to 110°C, stir and react for 12 hours, cool to 60°C, pour the reactant into 2000 grams of ethanol and 920 grams of In the settling tank of ethylene glycol monomethyl ether, high-speed stirring, the solid matter was precipitated, filtered, and vacuum-dried at 80°C for 10 hours to obtain 313.4 grams of imide oligomers (theoretical yield: 314.0 grams), with a yield of 99.8%. Denoted as BBMO-2.

Embodiment 3

[0048]1.0 g of 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (BAHPFP), 10.0 g of N,N,N',N',O-pentaglycidyl-4,4'- Diamino-4"-hydroxytriphenylmethane epoxy resin, 20.0 grams of N,N,N',N'-tetraglycidyl-1,4-bis(4-aminophenoxy)benzene epoxy resin, 20.0 g 4,5-epoxycyclohexane-1,2-dicarboxylate diglycidyl epoxy resin, 15.0 g CE793 epoxy resin, and 35.0 g N,N,N',N'-tetraglycidyl-2 ,2-bis[4-(4-aminophenoxy)phenyl]propane epoxy resin was put into the reaction kettle, stirred and mixed for 0.5 hours at 100°C, and then 2.0 g of BBMO-1 imide oligomer was added Continue to stir the reaction for 1 hour, then add 3.0 grams of 3-aminopropyltrimethoxysilane and stir the reaction for 5 minutes, cool to room temperature, and then add 15.0 grams of 1,8-diaza-bicyclo[5.4.0]undecene- 7 and 35.0 grams of tung oil anhydride, stirred and mixed evenly, obtained 156.0 grams of BAHPFP type silicon-containing epoxyimide matrix resin, denoted as M-1.

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Abstract

The invention relates to BAHPEP type silicon-containing epoxy imide matrix resin and a preparation method thereof. The BAHPEP type silicon-containing epoxy imide matrix resin is prepared from 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane BAHPFP, epoxy resin, 3-aminopropyl tri-alkoxy silane, an imide oligomer and a curing agent. The preparation method comprises the following steps: (1) preparing the imide oligomer; (2) putting the BAHPFP and the epoxy resin in a reaction kettle; after stirring and carrying out a mixing reaction, adding the imide oligomer, continuously stirring and reacting, then adding the 3-aminopropyl tri-alkoxy silane for stirring and reacting, and then adding the curing agent for uniformly stirring and mixing, thus obtaining the BAHPEP type silicon-containing epoxy imide matrix resin. The BAHPEP type silicon-containing epoxy imide matrix resin disclosed by the invention can be widely applied to adhesion between metals of steel, copper, aluminum and the like and basal materials of ceramics, glass, resin-based composite materials and the like and preparation of fiberglass, aramid fiber and carbon fiber reinforced composite materials, and has a good industrial prospect.

Description

technical field [0001] The invention belongs to the field of polymer matrix resin and its preparation, in particular to a BAHPFP silicon-containing epoxyimide matrix resin and a preparation method thereof. Background technique [0002] As we all know, epoxy resin has many excellent properties: (1) Good bonding performance: high bonding strength, wide bonding surface, it is compatible with many metals (such as iron, steel, copper, aluminum, metal alloys, etc.) The bonding strength of metal materials (such as glass, ceramics, resin-based composite materials, wood, plastics, etc.) is very high, and some even exceed the strength of the bonded material itself, so it can be used in many stressed structural parts. One of the main components of the mixture; (2) good processing performance: the flexibility of epoxy resin formula, the diversity of processing technology and product performance are the most prominent among polymer materials; (3) good stability performance: ring The cur...

Claims

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Application Information

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IPC IPC(8): C08G73/12
CPCC08G73/125
Inventor 虞鑫海周志伟
Owner DONGHUA UNIV
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