Resin composition, glue solution, prepreg and copper-clad plate containing same and preparation methods

A technology of resin composition and copper clad laminate, applied in the direction of chemical instruments and methods, synthetic resin layered products, lamination, etc., can solve problems such as foaming, low production efficiency, and no glue flow

Active Publication Date: 2016-11-23
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the excessively high curing temperature (180°C) of the glue used for copper-clad laminates in the prior art, the poor heat resistance and CAF resistance of the plate, and the inability to adapt to many production process requirements, and to change The curing system is prone to fast or slow curing due to unreasonable matching of gel time and vehicle speed, resulting in sticky rollers, f

Method used

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  • Resin composition, glue solution, prepreg and copper-clad plate containing same and preparation methods

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] 1. Preparation of glue for lead-free process copper clad laminates cured by PN (novolac resin):

[0067] Raw material formula:

[0068] Resin: 280 parts of brominated bisphenol A epoxy resin, 120 parts of multifunctional epoxy resin; the multifunctional epoxy resin here is low viscosity trifunctional epoxy resin, product name: MY0500, epoxy value: 8.6-9.5 (Eq / kg), viscosity at 25°C (mPas): 2000-5000; MY0500 is a product model in the Araldite product series of Huntsman.

[0069] Curing agent: 90 parts of novolac resin (softening point at 105-110° C.) with O-P ratio (ortho-para ratio is 50%-56%);

[0070] Curing accelerator: 0.4 parts of 2-phenylimidazole (C-2 substitution);

[0071] Solvent: 100 parts of dimethylformamide (DMF), 30 parts of acetone;

[0072] Inorganic filler: 50 parts of silicon dioxide, 80 parts of talcum powder.

[0073] Preparation method: mix curing agent, accelerator and solvent, stir at 800rpm for 5 hours until dissolved to obtain mixture A; (2...

Embodiment 2

[0083] 1. Preparation of glue for PN cured lead-free process copper clad laminate:

[0084] Raw material formula:

[0085] Resin: 400 parts of brominated bisphenol A epoxy resin;

[0086] Curing agent: 110 parts of high ortho novolak resin (O-P ratio is 140%-150%, softening point is 85°C);

[0087] Curing accelerator: 0.3 parts of 2-methylimidazole;

[0088] Solvent: 110 parts of dimethylformamide (DMF), 20 parts of acetone;

[0089] Inorganic filler: 50 parts of silicon dioxide, 60 parts of talcum powder.

[0090] Preparation method: mix curing agent, accelerator and solvent, stir at 800rpm for 5 hours until dissolved to obtain mixture A; (2) mix mixture A with brominated bisphenol A epoxy resin, and stir at 1000rpm for 5 hours Stir until the mixture B is uniform; (3) Mix the mixture B with the opacifying agent and the filler under stirring conditions, shear at a high speed of 2500rpm for 1.5 hours, stir at a speed of 1000rpm for 8 hours and ripen it.

[0091] 2. PN cure...

Embodiment 3

[0101] 1. Preparation of glue for lead-free process copper clad laminates cured by PN (novolac resin):

[0102] Raw material formula:

[0103] Resin: 380 parts of bisphenol F epoxy resin;

[0104] Curing agent: 110 parts of novolak resin (softening point at 100°C);

[0105] Curing accelerator: 0.35 parts of 2-phenylimidazole (C-2);

[0106] Solvent: 90 parts of dimethylformamide (DMF), 40 parts of acetone;

[0107] Inorganic filler: 30 parts of silicon dioxide, 70 parts of talcum powder.

[0108] Preparation method: mix curing agent, accelerator and solvent, stir at 800rpm for 5 hours until dissolved to obtain mixture A; (2) mix mixture A with bisphenol F epoxy resin, stir at 1000rpm for 5 hours to Stir evenly to obtain mixture B; (3) under stirring conditions, mix mixture B with silicon dioxide and talcum powder, shear at a high speed of 2500 rpm for 1.5 hours, stir at a speed of 1000 rpm for 8 hours, and then mature.

[0109] 2. PN cured lead-free process copper clad la...

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Abstract

The invention discloses a resin composition, a glue solution, a prepreg and a copper-clad plate containing the same and preparation methods. The resin combination is prepared from, by weight, 380-500 parts of epoxy resin, 80-110 parts of curing agent, 0.2-0.4 part of curing catalyst, 80-140 parts of solvent and 70-150 parts of inorganic filler. The curing agent is linear phenolic resin. In the preparation methods of the glue solution, the prepreg and the copper-clad plate, the resin composition is adopted, their preparation methods are simple in process, low in cost, environmentally friendly, technologically stable, low in defective rate, strong in process controllability and suitable for mass production. The copper-clad plate has good comprehensive performance, and especially the acid, alkali, solvent and heat resistance is good.

Description

technical field [0001] The invention specifically relates to a resin composition, a glue containing the same, a prepreg, a copper-clad laminate, and a preparation method. Background technique [0002] The introduction of the lead-free process changes the traditional tin-lead solder to lead-free solder, and greatly increases the melting point temperature of the original solder from 180°C to 217°C, such as tin-silver-copper (such as SAC305 solder tab). In lead-free soldering, the relatively rigid lead-free solder balls will uproot the copper pad and the bottom resin substrate from time to time, or cause various internal microcracks. The dicyandiamide (Dicy) curing system is widely used in the production of copper clad laminates, but its curing temperature compatible with epoxy resin is too high (180 ° C), the heat resistance of the board, and the resistance to CAF (Conductive Anodic Filament, refers to anodic glass fiber Wire leakage phenomenon) and other poor performance, so...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08G59/62C08K3/36C08K3/34B32B15/092B32B15/20B32B27/04B32B27/20B32B27/38B32B37/06
Inventor 李清亮
Owner SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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