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A Chip Temperature Prediction Method Based on Heat Conduction Theory

A prediction method and heat conduction technology, applied in electrical digital data processing, special data processing applications, instruments, etc., can solve problems such as damage to electronic circuits, and achieve the effects of simple operation, good operability, and avoiding excessive loss.

Active Publication Date: 2019-01-22
NAT UNIV OF DEFENSE TECH
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  • Application Information

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Problems solved by technology

If this specific preset value is set higher, then some electronic circuits may be irreversibly damaged during the implementation of the cooling measures due to the inherent response time of the cooling measures; if the setting is lower, then the processor will be sacrificed Part of the performance

Method used

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  • A Chip Temperature Prediction Method Based on Heat Conduction Theory
  • A Chip Temperature Prediction Method Based on Heat Conduction Theory
  • A Chip Temperature Prediction Method Based on Heat Conduction Theory

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Embodiment Construction

[0034] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0035] Such as figure 1 As shown in FIG. 1 , it is a schematic diagram of the principle of a processor heat dissipation model in a specific application example. Independent computing nodes are arranged to form a layer of silicon layer 101, and a cooling plate 102 and a heat sink 103 are arranged below, while the same several silicon layers form the entire processor. Since the contact area between the silicon layer 101 and the silicon layer 101 is much larger than the contact area between the computing nodes in one layer, most of the heat generated by the processor is transmitted vertically from top to bottom, which is very A small part of the heat is transferred out of the system through the horizontal computing nodes. Therefore, the core idea of ​​the present invention is to simplify the heat dissipation model of the processor. It ...

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Abstract

A chip temperature prediction method based on the heat conduction theory comprises the steps that S1, a heat radiation model of a processor is constructed, the temperature change rate of the processor at the moment t is correlated with input power P(t) at the moment t, temperature T(t) at the moment t and thermal resistance R and thermal capacitance C of the processor through a thermal transfer model of one-dimensional steady state thermal conduction, and then an RC model of temperature changes is formed; S2, RC numerical value extraction is carried out in the heat radiation model, and the numerical value of the thermal resistance R and the numerical value of the thermal capacitance C are obtained; S3, a temperature prediction expression is constructed through the numerical value of the thermal resistance R and the numerical value of the thermal capacitance C; S4, temperature prediction is carried out, wherein the input power P(t) of the processor at a certain moment and the temperature T(t) of the processor at the moment are input, and the temperature of the processor at the next moment is calculated through the temperature prediction expression in S3. The chip temperature prediction method has the advantages of being simple in theory, easy and convenient to implement, low in hardware expense, high in processing speed and the like.

Description

technical field [0001] The invention mainly relates to the field of microprocessor design, in particular to a chip temperature prediction method based on heat conduction theory. Background technique [0002] Applications such as image processing, modern communications, and weather data analysis require ultra-high-performance processors to process large amounts of data. Driven by this demand, the design, manufacturing technology and performance of processors are constantly improving. The typical feature is the continuous improvement of transistor integration and operating frequency of processors. However, high integration and high operating frequency lead to high power consumption density of the processor, which in turn generates a large amount of heat when the processor runs at full speed, which also causes a problem of high temperature of the processor. [0003] At present, in processor design, a temperature sensor or a program counter is generally set to sense the tempera...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50
CPCG16Z99/00
Inventor 彭元喜海月田甜雷元武李勇万江华王建之贾宝东舒雷志张松松张榜
Owner NAT UNIV OF DEFENSE TECH
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