A high-frequency circuit board base material prepared from polyarylene oxadiazole fiber material

Abstract

The invention relates to a high-frequency circuit board substrate made from aromatic oxadiazole fibers. According to the invention, the aromatic oxadiazole short fibers and aromatic oxadiazole fibrids with excellent high temperature resistance are used for preparing fiber paper with small linear thermal expansion coefficient, uniform dielectric constant and excellent mechanical property according to a wet papermaking method through a certain technique. The processing techniques of gumming, overlapping, hot-pressing and the like are adopted on the basis of the fiber paper, so that the high-frequency circuit board substrate with low thermal expansion coefficient, high thermal dimensional stability and excellent processing property is acquired.

Description

technical field [0001] The invention relates to the field of electronics and composite materials, more specifically to a high-frequency circuit board base material. Background technique [0002] With the advancement of electronic design technology and manufacturing technology, electronic products are gradually developing towards high density, high functionality, light and thin, and high transmission rate; coupled with the rapid development of chip miniaturization and the increase in the number of data transmission , the operating frequency of the system is getting higher and higher. [0003] With the rapid progress of the communication industry and the development of communication technology from 2G, 3G to 4G, the original civilian communication frequency bands are crowded, and the high-frequency communication part is gradually given over to civilian use. The throughput of data transmission is getting bigger and bigger, the required bandwidth is getting wider and wider, and...

AI Technical Summary

Problems solved by technology

However, the above method is complex in process, para-aramid fiber or PBO precipitated fiber has high mechanical properties and modulus, it is difficult to disperse, it is difficult to improve the degree of beating, and it takes a long time for metal grinding and beating, so the prepared fiber paper metal There are many impurities, and at the same time, due to the high glass transition temperature of para-aramid or PBO precipitated fiber, it is difficult for the precipitated fiber to produce sufficient adhesion at high temperature, so the mechanical strength of the material is low, which affects its performance on the circuit board. Applications