Bonding material and bonding method using the same
A technology for joining materials and joining methods, applied in the direction of welding/cutting media/materials, nanotechnology for materials and surface science, welding media, etc., can solve the mechanical strength that cannot be used only to the extent that it cannot withstand pressure And other issues
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Embodiment
[0071]
[0072] In a 500 mL beaker, 13.4 g of silver nitrate (manufactured by Toyo Kagaku Co., Ltd. (Toyo Kagaku Co., Ltd.)) was dissolved in 72.1 g of pure water to prepare a silver solution.
[0073] Next, 1.34 L of pure water was added to a 5 L beaker, nitrogen gas was passed for 30 minutes, and the temperature was raised to 60° C. while removing dissolved oxygen. 17.9 g of sorbic acid (manufactured by Wako Pure Chemical Industries, Ltd. (Wako Pure Chemical Industries, Ltd.)) was added. Then, 2.82 g of 28% ammonia water (manufactured by Wako Pure Chemical Industries, Ltd.) was added to adjust the pH. In the following examples and comparative examples, the reaction starts with the addition of ammonia water. While stirring this, 5.96 g of aqueous hydrazine (purity 80% / manufactured by Otsuka Chemical Co., Ltd. (Otsuka Chemical Co., Ltd.)) was added 5 minutes after the start of the reaction.
[0074] Nine minutes after the start of the reaction, the silver solution was adde...
Embodiment 2
[0092] In Example 1, except that the main firing was set at 350° C. for 5 minutes, the bonded body and the fired film were formed in the same manner. The shear strength was 56.2 MPa, showing an extremely high value. In addition, the specific resistance of the fired film at this time was 2.4 μΩ·cm, and it had extremely high conductivity. Also, the SEM image of the obtained fired film is shown in Figure 4 . Although fired in nitrogen, interparticle sintering proceeded to such an extent that the shape of the particles could not be distinguished. This means that interparticle sintering is performed. Proportions etc. are shown in Table 1 or 2. In addition, test conditions are shown in Table 3. The crystallite diameter confirmed in the same manner as in Example 1 was 73.58 nm, and similarly from the results of photographs, it was found that crystal grains were growing.
Embodiment 1
[0094] In Example 1, except that 90.0 g of nanoparticles (coated with sorbic acid) of the metal component was changed to mixed spherical submicron silver particles (manufactured by DOWA Electronics Co., Ltd. / average particle diameter D50 value: 1.0 μm) 45.0 g and 45.0 g of sorbic acid-coated silver nanoparticles obtained by the method described in Example 1, in the same proportion, Example 1 was repeated. The total amount of metal components is 90.0 g, which is the same. Table 3 shows the evaluation results using the obtained bonding material.
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