High power LED radiating ceramic substrate containing perovskite and prepared by low temperature sintering

Abstract

The invention discloses a high power LED radiating ceramic substrate containing perovskite and prepared by low temperature sintering. The ceramic substrate uses an ionic liquid and deionized water as solvent media to substitute toxic organic solvents in a traditional tape casting process; the material dispersion and binding performance are improved; aluminum silicon sol-calcium lignosulfonate mixed sol as a dispersing agent and binder can make the materials to have good dispersion infiltration, and the effective components can reduce the oxygen content of a sintering atmosphere, and improve the purity of aluminum nitride crystal; the added calcium titanium powder can effectively reduce the sintering temperature of aluminum nitride ceramics, so as to obtain the ceramic body with good thermal conductivity and the density. The ceramic substrate can be applied to high power LED lamp, has good economic benefits and improves the defects of traditional aluminum nitride ceramics.

Description

technical field [0001] The invention relates to the technical field of aluminum nitride ceramics, in particular to a perovskite-containing high-power LED heat dissipation ceramic substrate formed by low-temperature sintering. Background technique [0002] The heat generated by high-power LED chips cannot be dissipated in a timely and effective manner, which will seriously affect the LED emission spectrum, luminous intensity, performance of packaging materials, and chip life. Therefore, the heat dissipation problem of high-power LEDs has always been a major technology in the solid-state lighting industry. Bottleneck, in LEDs produced by traditional packaging technology, substrate heat dissipation has become a key research object at home and abroad because of its direct and effective heat dissipation advantages. At present, aluminum-based heat dissipation substrates are widely used in research and application. However, with the improvement of LED heat dissipation requirements,...

AI Technical Summary

Problems solved by technology

At present, aluminum-based heat dissipation substrates are widely used in research and application. However, with the improvement of LED heat dissipation requirements, the defects of aluminum substrates are gradually manifested. The internal insulating layer leads to poor overall heat dissipation and easy junction temperature, thereby reducing the use of lamps. life

Compared with the aluminum substrate heat dissipation kit, the ceramic heat dissipation substrate has the advantages of high insulation, high thermal radiation, high thermal conductivity, and good electromagnetic compatibility, and has become an alternative material that has attracted much attention. Among them, aluminum nitride ceramics are packages with relatively ideal comprehensive performance. However, in practical applications, al