Boron-nitride-nanotube-doped aluminum nitride ceramic substrate for high-power LED (light-emitting diode) heat dissipation

Abstract

The invention discloses a boron-nitride-nanotube-doped aluminum nitride ceramic substrate for high-power LED (light-emitting diode) heat dissipation. In the ceramic substrate, an ionic liquid-deionized water mixture is used as a solvent medium instead of the toxic organic solvent in the traditional flow casting forming technique, thereby enhancing the raw material dispersity and binding property. Besides, an aluminum silica sol-polyvinyl alcohol mixed sol is used as a dispersing agent and adhesive, so that all the raw materials can be mutually combined and infiltrated, thereby achieving the efficient modification effect; and the effective components in the mixed sol can lower the oxygen content in the sintering atmosphere and enhance the thermal conductivity of the ceramic substrate. The doped boron nitride nanotubes can effectively improve the mechanical properties of the substrate. The ceramic substrate overcomes the defect of high brittleness in the traditional aluminum nitride ceramic, and has outstanding application value.

Description

technical field [0001] The invention relates to the technical field of aluminum nitride ceramics, in particular to an aluminum nitride ceramic substrate for heat dissipation of a high-power LED doped with boron nitride nanotubes. Background technique [0002] The heat generated by high-power LED chips cannot be dissipated in a timely and effective manner, which will seriously affect the LED emission spectrum, luminous intensity, performance of packaging materials, and chip life. Therefore, the heat dissipation problem of high-power LEDs has always been a major technology in the solid-state lighting industry. Bottleneck, in LEDs produced by traditional packaging technology, substrate heat dissipation has become a key research object at home and abroad because of its direct and effective heat dissipation advantages. At present, aluminum-based heat dissipation substrates are widely used in research and application. However, with the improvement of LED heat dissipation requireme...

AI Technical Summary

Problems solved by technology

At present, aluminum-based heat dissipation substrates are widely used in research and application. However, with the improvement of LED heat dissipation requirements, the defects of aluminum substrates are gradually manifested. The internal insulating layer leads to poor overall heat dissipation and easy junction temperature, thereby reducing the use of lamps. life

Compared with the aluminum substrate heat dissipation kit, the ceramic heat dissipation substrate has the advantages of high insulation, high thermal radiation, high thermal conductivity, and good electromagnetic compatibility, and has become an alternative material that has attracted much attention. Among them, aluminum nitride ceramics are packages with relatively ideal comprehensive performance. However, in practical applications, aluminum nitride ceramics have defects such as high sintering temperature and poor thermal conductivity, which restrict the popularization and application of products

[0003] The article "The Influence of Y2O3 and Nano-AlN Synergy on the Sintering Properties and Heat Conduction of Aluminum Nitride Ceramics" introduces the use of Y2O3 as a sintering aid and the synergistic effect of nano-AlN at low sintering temperatures to make nitrides with higher thermal conductivity. Aluminum ceramics, although this method improves the density of aluminum nitride ceramics to a certain extent, its thermal conductivity still needs to be improved, and the amount of nano-powder added must be strictly controlled, and it needs to be produced at a relatively high sintering temperature. Improving the Properties of Aluminum Nitride Ceramics