High-power LED heat-dissipation ceramic aluminum nitride substrate containing toughening carbon nanofibers

Abstract

The invention discloses a high-power LED heat-dissipation ceramic aluminum nitride substrate containing toughening carbon nanofibers. The ceramic substrate uses mixed ionic liquid and deionized water as a solvent medium to replace a toxic organic solvent in a traditional tape casting process, and the dispersibility and associativity of the raw materials are improved. In addition, the high-power LED heat-dissipation ceramic aluminum nitride substrate uses aluminum silicon sol-polyvinyl alcohol as a binder, and the effective components can reduce the oxygen content of sintering atmosphere and improve the purity of aluminum nitride lattices to obtain good heat-conducting property. The added carbon nanofibers can effectively improve the crack resistance strength and fracture toughness of a composite ceramic body and improve the defects of traditional aluminum nitride ceramics. The ceramic aluminum nitride substrate obtains good heat conductivity effect and excellent mechanical properties under the lower sintering temperature, greatly prolongs the service life of chips when being used as a high-power LED chip substrate and has good market efficiency.

Description

technical field [0001] The invention relates to the technical field of aluminum nitride ceramics, in particular to a high-power LED heat dissipation aluminum nitride ceramic substrate containing nano-carbon fiber toughened. Background technique [0002] The heat generated by high-power LED chips cannot be dissipated in a timely and effective manner, which will seriously affect the LED emission spectrum, luminous intensity, performance of packaging materials, and chip life. Therefore, the heat dissipation problem of high-power LEDs has always been a major technology in the solid-state lighting industry. Bottleneck, in LEDs produced by traditional packaging technology, substrate heat dissipation has become a key research object at home and abroad because of its direct and effective heat dissipation advantages. At present, aluminum-based heat dissipation substrates are widely used in research and application. However, with the improvement of LED heat dissipation requirements, t...

AI Technical Summary

Problems solved by technology

At present, aluminum-based heat dissipation substrates are widely used in research and application. However, with the improvement of LED heat dissipation requirements, the defects of aluminum substrates are gradually manifested. The internal insulating layer leads to poor overall heat dissipation and easy junction temperature, thereby reducing the use of lamps. life

Compared with the aluminum substrate heat dissipation kit, the ceramic heat dissipation substrate has the advantages of high insulation, high thermal radiation, high thermal conductivity, and good electromagnetic compatibility, and has become an alternative material that has attracted much attention. Among them, aluminum nitride ceramics are packages with relatively ideal comprehensive performance. However, in practical applications, aluminum nitride ceramics have defects such as high sintering temperature and poor thermal conductivity, which restrict the popularization and application of products

[0003] "Y 2 o 3 The effect of the synergistic effect of AlN and nano-AlN on the sintering performance and heat conduction of aluminum nitride ceramics" introduces the use of Y 2 o 3 As a sintering aid and nano-aluminum nitride, aluminum nitride ceramics with high thermal conductivity are produced at low sintering temperatures. Although this method improves the density of aluminum nitride ceramics to a certain extent, its thermal conductivity It still needs to be improved, and the addition of nano-powder must be strictly controlled, and the performance of aluminum nitride ceramics needs to be improved at a higher sintering temperature