Nano-graphite containing high-power LED radiating aluminum nitride ceramic substrate

Abstract

The invention discloses a nano-graphite containing high-power LED radiating aluminum nitride ceramic substrate. According to the ceramic substrate, ionic liquid and deionized water are mixed to be used as a solvent medium, a toxic organic solvent used in a traditional tape casting process is replaced, and dispersibility and associativity of all raw materials are improved. Besides, mixed slurry of aluminum silica sol-polyvinyl alcohol, graphene oxide and other raw materials is used as an adhesive, the wettability of all the raw materials is good, heat stability is good, the oxygen content of a sintering atmosphere is lowered, and the purity of an aluminum nitride crystal lattice is improved; added nano-graphite can improve the lubricity of the interior of a ceramic body, and wear resistance and hot-press resistance of a material is improved; the ceramic substrate has a good heat conduction effect and excellent mechanical properties, the surface is dense and smooth, and cracking and damage are not easy; when the ceramic substrate is used as a high-power LED chip substrate, the service life of a chip is greatly prolonged, and good market benefits are achieved.

Description

Technical field [0001] The invention relates to the technical field of aluminum nitride ceramics, in particular to a high-power LED heat dissipation aluminum nitride ceramic substrate containing nano graphite. Background technique [0002] The heat generated by high-power LED chips cannot be dissipated in time and effectively, which will seriously affect the emission spectrum, luminous intensity, packaging material performance, and chip life of the LED. Therefore, the heat dissipation problem of high-power LEDs has always been a major technology in the solid-state lighting industry. The bottleneck is that in LEDs produced by traditional packaging processes, substrate heat dissipation has become a key research object at home and abroad due to its direct and effective heat dissipation advantages. At present, most research applications are aluminum-based heat-dissipating substrates. However, with the increase in LED heat dissipation requirements, the defects of aluminum substrates h...

AI Technical Summary

Problems solved by technology

At present, aluminum-based heat dissipation substrates are widely used in research and application. However, with the improvement of LED heat dissipation requirements, the defects of aluminum substrates are gradually manifested. The internal insulating layer leads to poor overall heat dissipation and easy junction temperature, thereby reducing the use of lamps. life

Compared with the aluminum substrate heat dissipation kit, the ceramic heat dissipation substrate has the advantages of high insulation, high thermal radiation, high thermal conductivity, and good electromagnetic compatibility, and has become an alternative material that has attracted much attention. Among them, aluminum nitride ceramics are packages with relatively ideal comprehensive performance. However, in practical applications, aluminum nitride ceramics have defects such as high sintering temperature and poor thermal conductivity, which restrict the popularization and application of products

[0003] "Y 2 o 3 The effect of the synergistic effect of AlN and nano-AlN on the sintering performance and heat conduction of aluminum nitride ceramics" introduces the use of Y 2 o 3 As a sintering aid and nano-aluminum nitride, aluminum nitride ceramics with high thermal conductivity are produced at low sintering temperatures. Although this method improves the density of aluminum nitride ceramics to a certain extent, its thermal conductivity It still needs to be improved, and the addition of nano-powder must be strictly controlled, and the performance of aluminum nitride ceramics needs to be improved at a higher sintering temperature