Boron-doped modified aluminum nitride ceramic substrate applied to high-power LEDs

Abstract

The invention discloses a boron-doped modified aluminum nitride ceramic substrate applied to high-power LEDs. According to the ceramic substrate, ionic liquid and deionized water are mixed and are used as solvent media, so that toxic organic solvents in the conventional tape casting process are replaced, and dispersibility and combinability of the raw materials are improved. In addition, aluminum silicon sol-polyvinyl alcohol glycerin hybrid sol is used as a dispersant as well as an adhesive, so that the raw materials are effectively dispersed and infiltrated; effective components further can reduce the content of oxygen in sintering atmosphere, so that purity of aluminum nitride crystal lattices is improved; the doped boron powder can effectively improve the density of aluminum nitride ceramic and improve the mechanical property of the product; a ceramic body with high heat conductivity and high mechanical property can be finally produced; after the boron-doped modified aluminum nitride ceramic substrate is applied to the high-power LED lamps, good economical benefit can be achieved; the defect of the conventional aluminum nitride ceramic is improved.

Description

technical field [0001] The invention relates to the technical field of aluminum nitride ceramics, in particular to a boron-doped modified aluminum nitride ceramic substrate for high-power LEDs. Background technique [0002] The heat generated by high-power LED chips cannot be dissipated in a timely and effective manner, which will seriously affect the LED emission spectrum, luminous intensity, performance of packaging materials, and chip life. Therefore, the heat dissipation problem of high-power LEDs has always been a major technology in the solid-state lighting industry. Bottleneck, in LEDs produced by traditional packaging technology, substrate heat dissipation has become a key research object at home and abroad because of its direct and effective heat dissipation advantages. At present, aluminum-based heat dissipation substrates are widely used in research and application. However, with the improvement of LED heat dissipation requirements, the defects of aluminum substra...

AI Technical Summary

Problems solved by technology

At present, aluminum-based heat dissipation substrates are widely used in research and application. However, with the improvement of LED heat dissipation requirements, the defects of aluminum substrates are gradually manifested. The internal insulating layer leads to poor overall heat dissipation and easy junction temperature, thereby reducing the use of lamps. life

Compared with the aluminum substrate heat dissipation kit, the ceramic heat dissipation substrate has the advantages of high insulation, high thermal radiation, high thermal conductivity, and good electromagnetic compatibility, and has become an alternative material that has attracted much attention. Among them, aluminum nitride ceramics are packages with relatively ideal comprehensive performance. However, in practical applications, aluminum nitride ceramics have defects such as high sintering temperature and poor thermal conductivity, which restrict the popularization and application of products

[0003] "Y 2 o 3 The effect of the synergistic effect of AlN and nano-AlN on the sintering performance and heat conduction of aluminum nitride ceramics" introduces the use of Y 2 o 3 As a sintering aid and nano-aluminum nitride, aluminum nitride ceramics with high thermal conductivity are produced at low sintering temperatures. Although this method improves the density of aluminum nitride ceramics to a certain extent, its thermal conductivity It still needs to be improved, and the addition of nano-powder must be strictly controlled, and the performance of aluminum nitride ceramics needs to be improved at a higher sintering temperature