Coating slurry for diaphragm, composite heat resisting diaphragm and preparation method of composite heat resisting diaphragm
A technology for coating slurry and diaphragm, applied in the field of electrochemistry, can solve the problems of high closed-cell temperature, large distance between micro-powders, and inability to quickly fuse, etc., and achieve the effect of low closed-cell temperature and easy polymerization.
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Embodiment 1
[0029] Organic particle A: The polymer layer is polyvinylidene fluoride-hexafluoropropylene copolymer layer (P(VDF-HFP)), the melting point is 150°C, the melting point in the electrolyte is 105°C, and the thickness is 0.4um; insulating resin The monomer is an epoxy resin monomer containing two epoxy end groups in the molecule, with a melting point of 95°C and a D50 of 1.0um; the organic particle A is obtained by coating the polymer layer on the surface of the insulating resin monomer by surface polymerization.
[0030] Organic particle B: The polymer layer is polyvinylidene fluoride-hexafluoropropylene copolymer (P(VDF-HFP)), with a melting point of 150°C, a melting point of 105°C in the electrolyte, and a thickness of 0.4um; the insulating resin sheet The body is a diamine monomer containing two primary amino groups in the molecule, with a melting point of 95°C and a D50 of 1.0um; the organic particle B is obtained by coating the polymer layer on the surface of the insulating ...
Embodiment 2
[0036] Organic particle A: The polymer layer is polyvinylidene fluoride-hexafluoropropylene copolymer layer (P(VDF-HFP)), the melting point is 150°C, the melting point in the electrolyte is 105°C, and the thickness is 0.4um; insulating resin The monomer is an epoxy resin monomer containing two epoxy end groups in the molecule, with a melting point of 95°C and a D50 of 1.0um; the organic particle A is obtained by coating the polymer layer on the surface of the insulating resin monomer by surface polymerization.
[0037] Organic particle B: The polymer layer is polyvinylidene fluoride-hexafluoropropylene copolymer (P(VDF-HFP)), with a melting point of 150°C, a melting point of 105°C in the electrolyte, and a thickness of 0.4um; the insulating resin sheet The body is a diamine monomer containing two primary amino groups in the molecule, with a melting point of 95°C and a D50 of 1.0um; the organic particle B is obtained by coating the polymer layer on the surface of the insulating ...
Embodiment 3
[0042] Organic particle A: The polymer layer is polyvinylidene fluoride-hexafluoropropylene copolymer layer (P(VDF-HFP)), the melting point is 150°C, the melting point in the electrolyte is 105°C, and the thickness is 0.4um; insulating resin The monomer is an epoxy resin monomer containing two epoxy end groups in the molecule, with a melting point of 95°C and a D50 of 1.0um; the organic particle A is obtained by coating the polymer layer on the surface of the insulating resin monomer by surface polymerization.
[0043] Organic particle B: The polymer layer is polyvinylidene fluoride-hexafluoropropylene copolymer (P(VDF-HFP)), with a melting point of 150°C, a melting point of 105°C in the electrolyte, and a thickness of 0.4um; the insulating resin sheet The body is a diamine monomer containing two primary amino groups in the molecule, with a melting point of 95°C and a D50 of 1.0um; the organic particle B is obtained by coating the polymer layer on the surface of the insulating ...
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