Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A tube-fin microcirculation radiator and a microcirculation heat exchange system

A radiator and fin type technology, applied in cooling/ventilation/heating transformation, electrical components, electrical equipment structural parts, etc., can solve the problem that the radiator cannot meet the heat dissipation requirements, save auxiliary power and reduce processing links , the effect of reducing weight

Active Publication Date: 2019-06-11
CRRC DALIAN INST CO LTD
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the traditional radiator proposed above cannot meet the heat dissipation requirements under the condition of high power and high heat flux density, and researches and designs a tube-fin microcirculation radiator and a microcirculation heat exchange system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A tube-fin microcirculation radiator and a microcirculation heat exchange system
  • A tube-fin microcirculation radiator and a microcirculation heat exchange system
  • A tube-fin microcirculation radiator and a microcirculation heat exchange system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] Such as Figure 1 to Figure 3 As shown, a tube-fin microcirculation radiator includes a heat source module mounting plate 4 for installing a heat source module 3, a radiator mounting plate 5 and a heat dissipation assembly, and the heat source module mounting plate 4 and the radiator mounting plate 5 are fixed to each other And the main working medium cavity 7 for accommodating the working medium 8 is formed inside. The heat dissipation assembly includes a plurality of heat dissipation fins 12 stacked at a certain distance and a microcirculation heat dissipation module 9 penetrating in the heat dissipation fins 12. The microcirculation heat dissipation module 9 is a tubular structure with one end open and one end closed. The inside of the microcirculation dispersion module 9 is a division cavity 11. The radiator mounting plate 5 is provided with an installation port. The opening end of the microcirculation dispersion module 9 Installed at the installation opening on the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a segment-type microcirculation radiator and a microcirculation heat exchange system. The segment-type microcirculation radiator comprises a heat source module installation plate, a radiator installation plate and a heat dissipation assembly, wherein the heat source module installation plate and the radiator installation plate are fixed to each other and a main working medium cavity for accommodating a working medium is formed in the heat source module installation plate and the radiator installation plate; the heat dissipation assembly comprises a plurality of radiating fins which are stacked at certain distances, and microcirculation heat dissipation modules; the microcirculation heat dissipation modules are arranged in the corresponding radiating fins in a penetrating manner; each microcirculation heat dissipation module is of a tubular structure of which one end is opened and the other end is closed and a branch working medium cavity is formed in each microcirculation heat dissipation module; each branch working medium cavity communicates with the main working medium cavity; and liquid-absorbing micro-channels with capillary structures are arranged in the inner walls of the main working medium cavity and the branch working medium cavities and capillary channels of the liquid-absorbing micro-channels communicate with each other. The segment-type microcirculation radiator and the microcirculation heat exchange system are compact in structure, high in heat transfer efficiency, lower in noise, lower in auxiliary power consumption, high in reliability and wide in market prospect, and the problem of a main bottleneck in electron component industry development is well solved.

Description

technical field [0001] The invention relates to a radiator, in particular to a tube-fin microcirculation radiator and a microcirculation heat exchange system. Background technique [0002] With the development of science and technology, the miniaturization and high integration of high-power and high-performance electronic component application systems have led to a sharp increase in the calorific value of electronic equipment per unit volume and excessive local temperatures. When electronic components are in a high temperature state for a long time, they often fail due to overheating. In addition, when the use environment has strict restrictions on the volume and weight of the heat exchange system and the heat dissipation requirements are still high, it is difficult for the traditional forced liquid circulation cooling method, forced air cooling method or gravity heat pipe phase change cooling method to meet the requirements of high power, The heat dissipation requirement u...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
CPCH05K7/20336
Inventor 刘俊杰陈广泰王硕高世驹宗庆贺
Owner CRRC DALIAN INST CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com