Novel high-conductivity silver-free copper alloy material
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A silver-copper alloy and high-conductivity technology, which is applied in the field of new materials of high-conductivity silver-free copper alloys, can solve the problem of undensified copper crystal structure, and achieve the effects of compact crystal structure, low resistance and low resistance.
Inactive Publication Date: 2017-01-04
何国良 +1
View PDF6 Cites 1 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0007] (3) The copper crystal structure is not dense
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0027] A new material of high-conductivity silver-free copper alloy is composed of the following components by weight: 0.5% manganese, 0.01% cerium, 0.01% lanthanum, 0.002% lithium, and the rest is copper.
Embodiment 2
[0029] A new material of a high-conductivity silver-free copper alloy consisting of the following components by weight:
[0030] 1% manganese, 0.05% cerium, 0.05% lanthanum, 0.005% lithium, and the rest is copper.
Embodiment 3
[0032] A new material of a high-conductivity silver-free copper alloy consisting of the following components by weight:
[0033] 0.7% manganese, 0.03% cerium, 0.03% lanthanum, 0.003% lithium, and the rest is copper.
[0034] Another aspect of the present invention also discloses a method for preparing a high-conductivity silver-free copper alloy, comprising the following steps:
[0035] S1, select electrolytic copper with copper content of 99.99% as copper raw material;
[0036] S2, when the vacuum degree is -1P through the vacuum melting furnace, fill with argon to -0.6 to -0.3P;
[0037] S3, the copper is gradually melted after the moisture and residual gas in the heating furnace and the raw material are released;
[0038] S4, in the molten state of copper at 1150-1200 degrees, add 0.5-1% element manganese, 0.01-0.05% rare earth elements cerium and lanthanum, and 0.002%-0.005% lithium element. and other trace scattered elements, so as to completely remove impurities from ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Login to view more
Abstract
The invention discloses a novel high-conductivity silver-free copper alloy material which comprises, in weight percentage, 0.5%-1% of manganese, 0.01%-0.05% of cerium, 0.01%-0.05% of lanthanum, 0.002%-0.005% of lithium and the rest copper. The material has the advantages that the material is low in resistance and high in conductivity and reaches or closes to conductivity of silver. A silver-free copper alloy is a new energy-saving material of copper for electrical engineering and a new essential advanced function material in the field of future military industries and equipment manufacturing industries, and the silver-free copper alloy can replace the silver to use in part fields such as spaceflight, aviation, navigation, submarine and naval ship manufacturing, military equipment light weight, high-end electrical engineering, high-end electric products, energy-saving transformers and motors, wind energy, solar energy, electricity vehicles, new-energy electric vehicles or superconductivity.
Description
technical field [0001] The invention relates to the technical field of copper alloy materials, in particular to a new material of high-conductivity silver-free copper alloy. Background technique [0002] The statements in this section merely provide background information related to the present disclosure and may not constitute prior art. [0003] In the prior art, copper alloy materials have a conductivity between 98% and 99.89%, which severely limits the use of copper for electricians. [0004] The reasons for the low electrical conductivity of copper used in electricians at present: [0005] (1) Smelting under natural conditions makes the content of oxygen and other harmful gas impurities in copper high; [0006] (2) Impurities not higher than 0.005% are allowed to exist in the electrolytic copper and copper wire rods according to the standard stipulated by the state; [0007] (3) The crystal structure of copper is not kept secret. [0008] Therefore, the existing tec...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more 
Login to view more