An integrated structure of SMD power devices applied to electric vehicle electronic control products

Abstract

The invention discloses a patch-type power device integration scheme applied to an electric control product of an electric vehicle, and relates to the technical field of a new energy automobile. A thick-copper PCB (Printed Circuit Board) embedded or buried with a plurality of copper blocks is used as a main circuit carrier, a patch-type power device is welded on the copper blocks, a bus capacitor is welded on the thick-copper PCB, the thick-copper PCB is pressed on a heat dissipation cold plate, and an insulation heat conduction gasket is arranged between the thick-copper PCB and the heat dissipation cold plate. The patch-type power device is welded on the copper blocks, and heat is transmitted by means of high heat conductivity of copper; meanwhile, the peak impact capability can be effectively improved by heat capacity of the thick copper blocks; and the insulation heat conduction gasket is arranged between the thick-copper PCB and the heat dissipation cold plate, and thus, extremely low heat conduction resistance between the power device and the heat dissipation cold plate is achieved.

Description

technical field [0001] The invention relates to the technical field of new energy vehicles, in particular to a chip-type power device integration structure applied to electric vehicle electronic control products. Background technique [0002] In the prior art, more aluminum substrates or other metal substrates (hereinafter collectively referred to as aluminum substrates) are used. The aluminum substrate is composed of a copper layer on the surface, a thermally conductive insulating layer in the middle, and an aluminum layer on the bottom surface. The difference from ordinary PCB boards is mainly In order to replace the FR4 material with a thick and large metal layer, so as to obtain better thermal conductivity; however, the aluminum substrate cannot be provided with via holes, and often needs to be connected with another PCB board with multiple bus capacitors welded with a large number of screws, and then through The metal seat attached to the PCB board is crimped with the a...

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Problems solved by technology

[0003] The problems in the above technical solutions are as follows: 1. The metal substrate is difficult to withstand the thermal shock of automotive applications, and is easy to warp; 2. The PCB board and the aluminum substrate are arranged in double layers, and are electrically connected by a large number of screws, which are used in high-vibration environments of automobiles. 3. The metal substrate cannot be integrated with the bus capacitor, and it needs to be screwed to the PCB board where the bus capacitor is welded, which is a complicated process; 4. The PCB board where the bus capacitor is welded is fixed on the top of the power single tube, and the heat is serious. Great impact on capacitor life; 5. Metal substrate single-layer wiring, severe heat generation and large parasitic inductance, it is difficult to meet the requirements of low and medium parasitic inductance in automobiles; 6. The instantaneous thermal resistance of metal substrates is high, and it is difficult to meet frequent short-term peak power in automotive applications output requirements

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