Heat pipe and preparation method thereof

Abstract

The invention discloses a heat pipe and a preparation method thereof, and relates to the technical field of heat pipes. The heat pipe comprises a liquid suction core, and the liquid suction core is prepared from, by weight, 20-50% of water-atomized copper powder and 50-80% of foamy copper powder. The micro shape of the water-atomized copper powder is irregular, the oxygen content is low, the forming property is good, the process performance is stable, and the water-atomized copper power has fast capillary force. The foamy copper powder is a novel functional material formed by evenly distributing a large number of communicating or non-communicating holes in a copper substrate; and the electrical conductivity and the ductility of the foamy copper powder are good, the porosity is relatively high, and the heat-conducting property is good. By adjusting the ratio of the water-atomized copper powder to the foamy copper powder, the porosity and the moisture content of the prepared liquid suction core can be effectively controlled, and the prepared heat pipe can be made low in heat resistance and high in porosity and moisture content. Meanwhile, the preparation method of the heat pipe provided by the invention is simple in process and suitable for industrial heat pipe production.

Description

technical field [0001] The invention relates to the technical field of heat pipes, in particular to a heat pipe and a preparation method thereof. Background technique [0002] In recent years, with the continuous development of electronic technology, with the continuous improvement of human life requirements, the speed of electronic product replacement is getting faster and faster. The requirements of compactness and portability make electronic products smaller and smaller, but the chip circuits of electronic products are becoming more and more complex. Therefore, the heat dissipation problem of chip circuits has always plagued the operation and service life of the machine. The use of commonly used metal heat dissipation cannot Meet the heat dissipation requirements of the chip circuit. [0003] The National Laboratory of the United States first proposed the concept of heat pipe in the field of aerospace technology. The heat pipe is a new type of high-efficiency heat conduc...

AI Technical Summary

Problems solved by technology

The requirements of compactness and portability make electronic products smaller and smaller, but the chip circuits of electronic products are becoming more and more complex. Therefore, the heat dissipation problem of chip circuits has always plagued the operation and service life of the machine. The use of commonly used metal heat dissipation cannot Meet the heat dissipation requirements of the chip circuit

However, in some high-power heat pipes in the prior art, the raw material is composed of conventional atomized copper powder, which has low porosity and low water content, and cannot conduct effective heat transfer.

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