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Photosensitive resin composition and application thereof

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition and photosensitive resin laminate, can solve problems such as problems that cannot be completely solved

Active Publication Date: 2017-01-11
CHANGZHOU TRONLY NEW ELECTRONICS MATERIALS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But these don't completely solve the problem

Method used

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  • Photosensitive resin composition and application thereof
  • Photosensitive resin composition and application thereof
  • Photosensitive resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4

[0142] [Example 1-4, Comparative Example 1-4]

[0143]

[0144] Solution a was prepared by mixing 125 g of methacrylic acid, 275 g of methyl methacrylate, and 100 g of styrene as comonomers with 1.0 g of azobisisobutyronitrile.

[0145] 1.0 g of azobisisobutyronitrile was dissolved in a complex solution of 60 g of methyl cellosolve and 40 g of toluene to prepare a solution b.

[0146] In a flask equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel, and a nitrogen inlet tube, add methyl cellosolve and toluene in a mass ratio of 6:4 complex 400g, stir while blowing in nitrogen, and heat to 80°C.

[0147] The above-mentioned solution a was added dropwise thereto over 4 hours, and then kept at 80° C. for 2 hours while stirring. Next, the above-mentioned solution b was added dropwise to the solution in the flask over 10 minutes, and then the solution in the flask was kept at 80° C. for 3 hours while stirring the solution. Furthermore, the solution in t...

Embodiment 5-9

[0206] Examples 5-9 respectively use D5-D9 as component (D) sensitizing pigment to replace D1 in Example 1, and other conditions remain unchanged. Then, referring to the method described in Example 1, a photosensitive resin composition, a photosensitive element, and a laminate were prepared, and evaluated by the same method. The results are shown in Table 3.

[0207] table 3

[0208]

[0209] The structure of D5-D9 is as follows:

[0210]

[0211] As shown in Table 3, when the sensitizing pigment is selected from pyrazoline (especially the compound corresponding to general formula (a) or (b), the photosensitive resin composition also shows photosensitivity, reliability of cap hole , Excellent adhesion and resolution characteristics.

Embodiment 10-13

[0213] Examples 10-13 replace B1 in Example 2 with B6-B9 respectively, and other conditions remain unchanged, then refer to the method described in Example 2 to make a photosensitive resin composition, photosensitive element and laminate, and use the same method Make an evaluation. The results are shown in Table 4.

[0214] Table 4

[0215] B Example 10 Example 11 Example 12 Example 13 B6 10 B7 10 B8 10 B9 10 Photosensitivity (mJ / cm 2 )

35 35 50 50 Adhesion (μm) 15 14 15 11 Resolution (μm) 15 14 15 11 Cover hole rupture rate (%) 0 0 0 0

[0216] Table 4,

[0217] B6: compound of general formula (1), wherein n=1, A is ethyl, R 8 For methyl.

[0218] B7: compound of general formula (1), wherein n=5, A is ethyl, R 8 For methyl.

[0219] B8: compound of general formula (1), wherein n=1, A is propyl, R 8 For methyl.

[0220] B9: compound of general formula (1), wherein n=...

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Abstract

The invention discloses a photosensitive resin composition. The photosensitive resin composition comprises A) an adhesive polymer; B) a photopolymerizable compound having at least one ethylene unsaturated bond, C) a polymerizable initiator; and D) a sensitizing pigment. The photosensitive resin composition has good exposure sensibility and developing performance, under condition that a system contains an opacifier or the exposure dosage is low, the solidified pattern is complete and the development is clear, resolution is high, the sealing ability of the pattern and a substrate is excellent, and the photosensitive resin composition is suitable for making a photosensitive resin laminated body and forms the anti-corrosion pattern on the substrate.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a photosensitive resin composition, a photosensitive resin laminate comprising the photosensitive resin composition, and a method for forming a resist pattern on a substrate using the photosensitive resin laminate and the use of the resist pattern. Background technique [0002] Currently, printed wiring boards are manufactured by photolithography. The photolithography method refers to coating a photosensitive resin composition on a substrate, performing pattern exposure to polymerize and cure the exposed part of the photosensitive resin composition, and removing the unexposed part with a developing solution to form a resist pattern on the substrate, A method of forming a conductive pattern on a substrate by performing etching or plating to form a conductive pattern, and then peeling and removing the resist pattern from the substrate. [0003] In the above-mentioned ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/032G03F7/033G03F7/004
Inventor 钱晓春胡春青于培培刘文龙
Owner CHANGZHOU TRONLY NEW ELECTRONICS MATERIALS
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