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Fungal hypha composite thermal insulation board and preparation method thereof

A composite thermal insulation and mycelium technology, applied in fungi and other directions, can solve the problems of unsatisfactory water-repellent treatment effect of pearlescent sand, increased bulk density of pearlescent sand, unsatisfactory thermal insulation performance, etc., to achieve excellent thermal insulation effect, excellent thermal insulation anti-cracking, light weight effect

Inactive Publication Date: 2017-02-08
杭州欣阳保温节能建材有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, pearlite has a light bulk density, small particles, large specific surface area, and very high water absorption.
After the ordinary water-repellent agent is mixed with the pearl sand, most of them will enter the interior of the pearl sand particles, which will increase the bulk density of the pearl sand, resulting in a great increase in the bulk density of the obtained product, and further increase the thermal conductivity.
Moreover, the water-repellent treatment effect of the water-repellent agent on the pearlite is still unsatisfactory, and the water absorption rate of the obtained product is still very high.
Existing insulation boards made of inorganic materials such as perlite have high thermal conductivity and poor insulation performance

Method used

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  • Fungal hypha composite thermal insulation board and preparation method thereof
  • Fungal hypha composite thermal insulation board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-8

[0030] A kind of fungal mycelia composite insulation board, its raw material formula is shown in Table 2, and its preparation method is as follows:

[0031] 1. According to the formula in Table 2, the inorganic lightweight aggregate and the nutrient solution are mixed evenly to make a culture medium, and the culture medium is autoclaved (the sterilization method adopts conventional technology) to inoculate mycelia, and the inoculation amount of mycelia is 10 %, after the inoculation is completed, the mycelium is cultivated, the growth conditions of the mycelium are controlled, and the mycelium mixture is obtained after the mycelium is filled with the culture medium;

[0032] 2. Pre-mix the mycelium mixture with calcium stearate (powder) for 2-5 minutes, so that the calcium stearate powder is evenly coated on the surface pores of the inorganic lightweight aggregate and mycelium, and then mixed evenly Add curing agent (embodiment 1-5 is silicon phosphate, embodiment 6-8 is sodiu...

Embodiment 9

[0039] The specific preparation method of the insulation board of this embodiment is the same as that of Embodiment 1, the difference is that the composition (parts by weight) of the inorganic lightweight aggregate is: SiO 2 Airgel 80 parts, expandable graphite 12 parts, glass microspheres 20 parts, expanded perlite 40 parts, calcium silicate fiber 15 parts.

Embodiment 10

[0041] The specific preparation method of the insulation board of this embodiment is the same as that of Embodiment 1, the difference is that the composition (parts by weight) of the inorganic lightweight aggregate is: SiO 2 40 parts of airgel, 5 parts of expandable graphite, 10 parts of glass microspheres, 40 parts of expanded perlite, and 20 parts of calcium silicate fiber.

[0042] After testing, the performance of the fungal mycelium composite insulation board prepared in the above examples is compared with that of the existing hydrophobic perlite insulation board, and the data are shown in Table 2.

[0043] Table 2 Comparison of performance indicators between hydrophobic perlite insulation board and fungal mycelium composite insulation board

[0044]

[0045] It has been verified that the thermal conductivity of the product of the invention is low, and the thin fiber tube improves the compressive and flexural strength of the product. Examples 9 and 10 have better comp...

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Abstract

Belonging to the technical field of building materials, the invention relates to a preparation method of a thermal insulation material, in particular to a fungal hypha composite thermal insulation board and a preparation method thereof. The main raw material of the fungal hypha composite thermal insulation board is inorganic lightweight aggregate, the raw materials of the fungal hypha composite thermal insulation board include fungal hypha, the inorganic lightweight aggregate and a nutrient solution suitable for cultivation of fungal hypha are mixed uniformly to prepare a medium, the medium is employed to culture fungal hypha, and the obtained hypha mixture takes the place of the inorganic lightweight aggregate and is pressed to form a thermal insulation board. The thermal insulation board has the characteristics of excellent thermal insulation properties and crack resistance.

Description

technical field [0001] The invention belongs to the technical field of building materials, and relates to a preparation method of a thermal insulation material, in particular to a fungal mycelium composite thermal insulation board and a preparation method thereof. Background technique [0002] The current insulation boards are all made of expanded perlite or microporous calcium silicate materials. Perlite thermal insulation board is light and has excellent thermal insulation performance, fireproof, dustproof, moistureproof, no deformation modification, no rot and mildew, non-toxic, tasteless, good hydrophobicity, and the hydrophobicity rate can reach more than 98%. The construction is safe and easy, It is mainly used for insulation projects with special requirements such as walls and roofs of residential, industrial, and public buildings, swimming pools, cold storage, boilers, and some waterproofing. At present, insulation boards are all made of inorganic or organic materia...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B28/26C12N1/14
CPCC04B28/26C04B2111/28C04B2111/40C04B2201/20C04B2201/32C04B2201/50C12N1/14C04B7/00C04B14/18C04B14/06C04B14/202C04B14/204C04B14/46C04B22/16C04B14/064C04B14/22C04B22/126C04B24/42
Inventor 陈贤进
Owner 杭州欣阳保温节能建材有限公司
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