Brittle material punching method

A brittle material, processing brittle technology, applied in the field of laser drilling, can solve problems such as affecting production efficiency, affecting material strength, material stress accumulation, etc., to achieve the effect of reducing the scope of action, reducing the difficulty of splitting, and reducing costs

Active Publication Date: 2017-02-15
WUHAN HGLASER ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it takes a long time to punch holes, and it is easy to produce taper when dealing with thicker materials or larger apertures.
With the increase of the scanning time of the laser on the material, it is easy to cause the internal stress of the mat

Method used

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Experimental program
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Embodiment Construction

[0027] Below by specific embodiment the present invention is described in further detail:

[0028] The principle of the compound processing method in the present invention is: the ultrashort pulse laser is used to cut the sapphire into filaments, combined with the laser ablation technology to ablate the partial area of ​​the cutting center, combining the advantages of the two drilling techniques, to a certain extent, the The problem caused by stress release is eliminated, and the difficulty of splitting is significantly reduced.

[0029] Specifically, the scheme adopted in the present invention is:

[0030] like image 3 As shown, first draw a hollow ring with a diameter of 1 mm in the motion control software, adjust the appropriate parameters and turn on the laser, and the laser cuts a ring with a diameter of 1 mm on the sapphire surface through the cutting head and penetrates the sapphire layer (such as figure 1 As shown, the ring is an approximate ring, which is actually ...

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PUM

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Abstract

The invention relates to the technical field of laser punching, in particular to a brittle material punching method. Filamentation cutting is carried out on a brittle material to be processed with ultrashort laser pulse beams to form round rings penetrating through the brittle material; an ablation area is arranged in each round ring, each ablation area is of an appointed shape, the parts, of the appointed shapes, of the brittle material are removed in a laser ablation manner, and single bodies to be splintered which are not connected with one another and to be subjected to splintering processing are formed; and splintering processing is carried out on the single bodies to be splintered at the same time, so that punching machining on the brittle material is realized. Because filamentation cutting and laser ablation are combined, edge breakage of the brittle material is reduced, the area of the heat affect zone of the brittle material is reduced, the efficiency of punching is improved, the success rate of punching is increased, the cost is reduced, and the problems about efficiency and effect in the machining process are solved.

Description

technical field [0001] The invention relates to the technical field of laser drilling, in particular to a drilling method for brittle materials. Background technique [0002] Sapphire crystal is a multifunctional oxide with excellent optical, physical, chemical and mechanical properties. It is widely used in industry, national defense and scientific research. It is often used to make optical components, window materials and micro-mechanical devices. Especially the application on mobile phone products has attracted much attention again. Most applications require that sapphire must have high processing quality, but due to the high brittleness of sapphire, traditional mechanical processing is prone to chipping, cracks and tool wear, and due to its superior chemical stability, traditional chemical engraving However, laser processing technology has the characteristics of non-contact, simple operation and high flexibility, and can realize fast and efficient processing of any shap...

Claims

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Application Information

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IPC IPC(8): B23K26/382B23K26/402B23K26/0622
CPCB23K26/0624B23K26/382B23K26/402B23K2103/54
Inventor 王建刚王雪辉刘柱孙威李国栋程伟
Owner WUHAN HGLASER ENG CO LTD
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