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Curing adhesive used for preparation of microsection sample of printed circuit and preparation method thereof

A technology for metallographic slicing and printed circuits, applied in the direction of adhesives, non-polymer organic compound adhesives, etc., can solve the problems of complicated manufacturing process, high cost, poor transparency of cured products, etc., and achieve high bonding strength , low cost, good transparency

Active Publication Date: 2017-02-15
UNIV OF ELECTRONICS SCI & TECH OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Literature [Electroplating and Finishing, 2007, 26 (12): 21~24] and Chinese patent CN104535393A, have all introduced the method for making metallographic sample using self-setting tray powder and tray water, and this method is easy to make, molding Fast, but the used toothpaste powder is mostly mixed with colorants, and the transparency of the cured product is not good
At present, there are many kinds of acrylic curing adhesives on the market, but the production process is relatively complicated, and the cost is relatively high

Method used

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  • Curing adhesive used for preparation of microsection sample of printed circuit and preparation method thereof
  • Curing adhesive used for preparation of microsection sample of printed circuit and preparation method thereof
  • Curing adhesive used for preparation of microsection sample of printed circuit and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A component

[0029] Weigh 10 g of polymethyl methacrylate, add 0.1 g of benzoyl peroxide and 0.05 g of sodium lauryl sulfate to it, grind and mix evenly with a mortar;

[0030] B component

[0031] 4g of methyl methacrylate with a purity of 99.0% and 2g of acetone with a purity of 99.5% were weighed, and 0.01g of N,N-dimethyl-p-toluidine was added dropwise thereto, and stirred and mixed evenly.

[0032] Put the above-prepared components A and B in a mosaic mold with an inner diameter of 25 mm and a height of 22 mm at a mass ratio of 2:1, and cure at room temperature for 30 minutes. like figure 1 As shown, it is a transparent effect diagram of the mosaic slice after the cured glue is mixed and cured in this embodiment.

Embodiment 2

[0034] A component

[0035] Weigh 20 g of polymethyl methacrylate; add 0.15 g of benzoyl peroxide and 0.05 g of sodium dodecylbenzene sulfonate to it, and mix well.

[0036] B component

[0037] 8 g of methyl methacrylate with a purity of 99.0% and 4 g of ethyl acetate with a purity of 99.5% were weighed, and 0.03 g of N,N-dimethylaniline was added thereto, and stirred and mixed uniformly.

[0038] Put the above-prepared components A and B in a mosaic mold with an inner diameter of 25 mm and a height of 22 mm at a mass ratio of 2:1, and cure at room temperature for 30 minutes. like figure 2 As shown, it is the effect diagram of the cured glue of this embodiment used for metallographic section observation of the metallographic structure.

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Abstract

The invention specifically relates to a curing adhesive used for preparation of a microsection sample of a printed circuit and a preparation method thereof, belonging to the technical field of metallographical detection of printed circuits. The curing adhesive is composed of a component A and a component B. The component A comprises, by mass, 98.5 to 99.5% of an acrylate polymer, 0.5 to 1.5% of an initiator and 0.1 to 0.5% of a surfactant; and the component B comprises 50 to 70% of acrylate monomer, 0.45 to 1% of a promoter and 30 to 50% of a cosolvent. In use, the component A and the component B are uniformly mixed according to a mass ratio of 1.5 to 2.5, and the obtained mixture is cured in an inlaid mold at room temperature for 0.5 to 1.5 h. The curing adhesive provided by the invention is simple in composition; the preparation method is simple to operate and low in cost; and the curing adhesive is fast in molding, slow in heat release, good in transparency, high in bonding strength with a microsection and applicable to preparation of the microsection sample of the printed circuit and to metallographic observation and analysis.

Description

technical field [0001] The invention belongs to the technical field of metallographic detection of printed circuits, and in particular relates to a curing glue for metallographic slice sample preparation of printed circuits and a preparation method thereof. Background technique [0002] The production of printed circuit boards is a process of multi-process coordination. The quality of the product in the previous process directly affects the production of the product in the next process, and even directly affects the quality of the final product. Therefore, the key process is quality control. Printed circuit board technology has developed to the present, and there are dozens of special quality testing equipment and instruments. As one of the detection methods, metallographic section technology plays an irreplaceable role in this field. [0003] Metallographic sectioning technology has the advantages of relatively small equipment investment, wide application range, high rel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06
CPCC09J4/06
Inventor 陈苑明申桃王守绪何为高箐遥文娜何雪梅王翀周国云
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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