Device for sintering high-temperature-resistant material and application of device
A high-temperature-resistant panel technology, applied in the field of high-temperature-resistant materials, can solve the problems of uneven temperature of high-temperature-resistant materials, bonding of uncontrollable sintering devices, poor microstructure, etc., and achieve good anti-adhesion, controllable appearance and simple structure Effect
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Embodiment 1
[0072] (1) Weigh 15.0 grams of boron nitride powder and 50 grams of soluble starch, add 5000 milliliters of deionized water and 5000 milliliters of absolute ethanol, and stir well to obtain a sintering aid suspension.
[0073] (2) Take by weighing 670 grams of fused silica glass fiber, 220 grams of alumina fiber, 110 grams of yttrium oxide stabilized zirconia fiber, the suspension in (1) and 500 liters of deionized water and mix, use a high-speed shear mixer to mix the fiber in Uniformly disperse in deionized water to obtain a slurry.
[0074] (3) The above-mentioned slurry is poured into the forming mold, and the target density of the final product obtained by adjusting the height of the mold is 0.14g / cm 3 . Use suction filtration to filter out most of the water until it stops dripping when standing under normal pressure. Then the mold is transferred to a pressure forming machine, and a pressure of 2.5 MPa is applied to obtain a ceramic fiber heat-insulating tile wet body. ...
Embodiment 2 to 5
[0078] Except the content shown in the following table, it carried out in the same manner as Example 1.
[0079] Example Openness (%) Aperture ratio Consistency score 1 20 4:5 4.7 2 5 9:10 4.6 3 30 4:5 4.4 4 20 1:1 4.1 5 20 1:1 3.2 6 20 9:10 4.9
[0080] Note:
[0081] (1) Openness (%) refers to the percentage of the total area of gaps and through-holes to the total area of the inner cavity enclosed by side panels;
[0082] (2) Aperture ratio means the ratio of the aperture on the outer wall (aperture of the outer wall) of the through hole to the aperture on the inner wall of the through hole (aperture of the inner wall);
[0083] (3) Embodiment 4 is that the side wall is not provided with a through hole;
[0084] (4) In Embodiment 5, the aperture diameters of the through holes on the four side panels all decrease by 10% equidistantly to both sides along the center line.
Embodiment 6
[0086] Except that the four top grooves of the top panel of the sintering device used are through, and the four side panels can pass through the corresponding through grooves of the top panel, so that the top panel can sink along with the force of gravity, the other is the same as the embodiment 1 prepared in the same way, the thickness of the final material is 3.45% smaller than the expected thickness.
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