Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electrode Thin Film Process Technology for Uncooled Focal Plane Detector Packaging

A focal plane detector and process technology technology, applied in metal material coating process, circuits, electrical components, etc., can solve the problems of film release, film cavity generation, etc., to improve life and reliability, high strength Effect

Active Publication Date: 2020-06-05
KUNMING INST OF PHYSICS
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] What the present invention aims to solve is the problem of defilming between the film systems and voids in each film system during the high-temperature welding process of the existing electrode film, and provides a non-refrigerated focal plane detector with high reliability and long life. Electrode film technology for packaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Embodiment 1: An electrode thin film process technology for uncooled focal plane detector packaging. Five layers of metal films are sequentially deposited on the detector window. The first layer is a chromium film, the second layer is a chromium-nickel alloy film, and the third layer is It is a nickel film, the fourth layer is a nickel-gold film, the fifth layer is a gold film, and the second and fourth layers are alloy films, that is, the first and third layers and the third and fifth layers Two different types of thin films are grown between the layers of the film at the same time to achieve interdiffusion of the two metal films, so that the strength between the layers of the film system is high, and no voids will be generated after welding, which improves the life and reliability of the components.

[0021] The preparation steps of this process technology are:

[0022] 1) Pre-treatment of detector window coating:

[0023] Wet cleaning and dry cleaning are performed ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention relates to an electrode thin-film process technology for packaging of an uncooled focal plane detector, in particular to the electrode thin-film process technology for packaging of the uncooled focal plane detector with high reliability and long service life. According to the process technology, five layers of metal films are sequentially deposited on a detector window, wherein the first layer is a chrome film, the second layer is a chrome-nickel alloy film, the third layer is a nickel film, the fourth layer is a nickel-gold film, and the fifth layer is a gold film; the second layer and the fourth layer are alloy films, that is, two different types of thin films are grown simultaneously between the first-layer film and the third-layer film as well as between the third-layer film and the fifth-layer film, so that the two metal films interdiffuse, the strength between all layers of films is high, no cavities are generated after welding, the service life of an assembly is prolonged, and the reliability of the assembly is improved. A transition layer is arranged between every two adjacent electrode films to increase adhesive force between the layers. After welding, solder and the welding layers interdiffuse, no cavities are generated after welding, the service life of the assembly is prolonged, and the reliability of the assembly is improved.

Description

technical field [0001] The invention relates to an unrefrigerated focal plane detector, in particular to an electrode film technology for packaging an unrefrigerated focal plane detector with high reliability and long life. Background technique [0002] Since the uncooled focal plane detector has the advantages of no refrigeration, low cost, low power consumption, light weight, miniaturization, fast start-up, convenient use, and flexibility, it has developed from small-scale to medium- and large-scale 320×240 And 640×480 array, in the next few years, it is expected to obtain a large-scale 1024×1024 uncooled focal plane array, and the pixel size is also reduced from 50um to 17um, which further improves the focal plane sensitivity. This uncooled focal plane detector is more and more widely used in military and civilian fields, and some models have been equipped with troops, especially in light weapon sights, driver vision enhancers, individual helmet sights, handheld thermal i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24C23C14/14C23C14/16H01L31/09H01L31/0203
CPCC23C14/14C23C14/24C23C14/30H01L31/0203H01L31/09
Inventor 袁俊赵鹏黎秉哲何雯瑾龚晓霞信思树冯江敏苏玉辉莫镜辉
Owner KUNMING INST OF PHYSICS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products