Solder resist composition, and coated printed wiring board

A technology for printed wiring boards and compositions, applied in the field of solder resist compositions and coated printed wiring boards, capable of solving problems such as resolution reduction

Inactive Publication Date: 2017-03-22
GOO CHEM IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the black solder resist layer contains a large amount of black colorant, it will cause a decrease in resolution due to the black colorant absorbing light

Method used

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  • Solder resist composition, and coated printed wiring board
  • Solder resist composition, and coated printed wiring board
  • Solder resist composition, and coated printed wiring board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5、 comparative example 1～3

[0229] These components were mixed in the ratio shown in Table 1, thereby preparing a solder resist composition.

[0230] In addition, a wiring board provided with copper conductor wiring with a line width / line pitch of 0.2 mm / 0.3 mm and a thickness of 35 μm was prepared. The solder resist composition is applied on the surface of the wiring board by a screen printing method to form a wet coating film. The wet coating film was heated at 80°C for 20 minutes to perform preliminary drying to form a dry coating film having a thickness of 20 μm.

[0231] A mask for forming tin banks with widths of 25 μm, 50 μm, 75 μm, and 100 μm is closely attached to the dried coating film, and the irradiation energy density is 400 mJ / cm 2 Under the condition of irradiating ultraviolet rays, the dry coating film on the wiring substrate is selectively exposed.

[0232] The exposed dry coating film is subjected to a development process with a sodium carbonate aqueous solution, so that the part cured by the...

Embodiment 6～10、 comparative example 4～6

[0263] These components were mixed in the ratio shown in Table 2 below, thereby preparing a second resist composition.

[0264] [Table 2]

[0265] Raw material of the second resist composition Composition (parts by mass) Unsaturated resin solution containing carboxyl group80 Photopolymerizable monomer12 Crystalline epoxy compound20 Photopolymerization initiator A6 Photopolymerization initiator B0.15 Barium sulfate50 Micronized silica3.5 Melamine0.6 Green colorant1.1 Defoamer3 Solvent 7

[0266] In addition, a wiring board provided with copper conductor wiring with a line width / line pitch of 0.2 mm / 0.3 mm and a thickness of 35 μm was prepared. The solder resist composition used in Examples 1 to 5 and Comparative Examples 1 to 3 was coated on the surface of the wiring board by a screen printing method, thereby forming a first coating film. The first coating film was pre-dried by heating at 80°C for 20 minutes, and the thickness was 20 μm.

[0267] The second resist comp...

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Abstract

This solder resist composition contains a carboxyl group-containing resin (A), a photopolymerizable compound (B) containing at least one kind selected from the group consisting of a photopolymerizable momomer and a photopolymerizable prepolymer, a photopolymerization initiator (C), a thermosetting component (D), a perylene based black colorant (E1), and one kind of colorant (E2) other than black, the solder resist composition having such properties that the coating of the solder resist composition photocured one a copper plate and then thermoset to have any thickness within the range of 18-22 [Mu]m has a L* value of 40 or less, and a* value in the range of 5.1-55, and a b* value in the range of -15-15.

Description

Technical field [0001] The present invention relates to a solder resist composition and a coated printed wiring board. Specifically, the present invention relates to a liquid solder resist composition having photocurability and capable of being developed with an alkaline solution, and a covered printed wiring board provided with a solder resist layer formed from the solder resist composition. Background technique [0002] In recent years, a method of using a liquid solder resist composition instead of a screen printing method has sometimes been used to form a solder resist layer of a printed wiring board for consumer and industrial use. The method using liquid solder resist has excellent resolution and can be developed, and therefore, a printed wiring board with high-density wiring can be formed. [0003] By covering the printed wiring board with a colored solder resist layer, particularly a black solder resist layer, the conductor wiring of the printed wiring board can be difficu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004C08F2/50C08F290/00C08G59/40G03F7/027G03F7/095H05K3/28
CPCC08F2/50C08F290/00C08G59/40G03F7/004G03F7/027G03F7/095H05K3/28
Inventor 樋口伦也丸泽尚荒井贵
Owner GOO CHEM IND
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