Printed circuit board, manufacturing method thereof, and electronic device

Abstract

The present invention discloses a printed circuit board, a manufacturing method thereof and an electronic device. The printed circuit board comprises a circuit board body, a circuit requiring electrostatic protection, and an electrostatic discharge circuit; a hole penetrating the circuit board body is formed in the circuit board body; a first conductive terminal and a second conductive terminal which are located at two ends of the hole respectively and are separated from each other by a certain distance, and an insulating filler are arranged in the hole; the first conductive terminal is connected with the circuit requiring electrostatic protection; the second conductive terminal is connected with the electrostatic discharge circuit; the first conductive terminal and the second conductive terminal are properly shaped so that a point discharge effect can be realized between the first conductive terminal and the second conductive terminal; and therefore, a three-dimensional point discharge structure can be formed on the printed circuit board, so that electrostatic protection for the printed circuit board can be realized. With the printed circuit board provided by the embodiments of the present invention adopted, processing costs, material costs and design costs can be reduced, and therefore, production costs can be greatly reduced, and an electrostatic protection effect can be improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a printed circuit, its manufacturing method and electronic equipment. Background technique [0002] As the integration of components on printed circuit boards (Printed Circuit Board, PCB) in various electronic devices is getting higher and higher, there are more and more electronic device failures caused by electrostatic discharge (Electro-Static discharge, ESD). The electrostatic discharge problem not only leads to misoperation or failure of electronic equipment, but in severe cases, it may even break down integrated circuit chips and other precision electronic components and cause the equipment to be scrapped. Therefore, an electrostatic protection scheme to prevent the above electrostatic discharge problem emerges as the times require. [0003] The existing ESD protection schemes mainly include the following two types: [0004] Option 1. Connect electrostatic protection ...

AI Technical Summary

Problems solved by technology

[0007] 1. It is necessary to add additional physical components for electrostatic protection, which increases the bill of materials (Bill of Materials, BOM) cost, especially for multimedia and portable mobile terminals with many external interfaces, the increase in BOM cost of the electrostatic protection part will be very significant;

[0008] 2. Numerous electrostatic protection devices occupy the precious component layout area on the surface of the printed circuit board, especially in the increasingly compact layout of mobile phone printed circuit boards, electrostatic protection devices occupy a large amount of layout area, resulting in tight layout area of ​​mobile phone printed circuit boards, Even to save the layout area, the functions of the whole machine are deleted;

[0009] 3. Due to the requirements of surface mount technology (Surface Mount Technology, SMT) and other welding processes, the signal pads of the electrostatic protection device and the circuit (such as the peripheral interface) that need electrostatic protection need to be separated by a certain distance, which leads to the external interface There is no protection for the printed circuit board wiring from the signal to the electrostatic protection device. When other signal wiring is close to this wiring, static electricity may be released to other signal wiring, causing interference and damage to other circuits.

[0010] In the second solution, although the pad does not increase the BOM cost, it still needs to be laid out on the surface of the printed circuit board, occupying the PCB surface layout area, so there are also defects 2 and 3 in the first solution

[0011] 4. The distance between the discharge tips of the two triangular protective pads is limited by the minimum line spacing in the printed circuit board manufacturing process. If it is too close, it may be short-circuited or the printed circuit board may be difficult to etch;

[0012] 5. Since the circuit in the printed circuit board is formed by etching the copper surface with acid and other corrosive solutions, the acute-angled tip formed on the circuit plane of the printed circuit board will appear arc-shaped, resulting in unsatisfactory tip discharge effect

[0013] To sum up, it can be seen that the use of existing electrostatic protection schemes will lead to problems such as high production costs of printed circuit boards and poor electrostatic discharge effects.

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