Low-viscosity polyamide acid copolymer, preparation method of polyamide acid copolymer and polyimide film

A polyamic acid, low-viscosity technology, applied in the field of preparation of low-viscosity polyamic acid copolymers, can solve the problems of poor leveling, poor operability, affecting the performance of polyimide films, etc., and achieve good mechanical properties and insulation performance, fast drying and film formation, and the effect of improving leveling and operability

Inactive Publication Date: 2017-05-10
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the molecular weight of the obtained polyamic acid is too high, its viscosity is relatively high, which leads to poor leveling and poor operability. Properties of imide films

Method used

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  • Low-viscosity polyamide acid copolymer, preparation method of polyamide acid copolymer and polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Add 10.0g of 4,4'-diaminodiphenyl ether into a three-necked flask, then add 83g of N,N-dimethylacetamide, and stir to dissolve for 40min. After the dissolution is complete, add 0.625 g of dimethyl pyromellitate and 10.34 g of pyromellitic dianhydride, the solid content of the solution is 20%, and react at room temperature for 7 hours to obtain a polyamic acid copolymer.

[0019] Under the condition of 25°C, the viscosity of the copolymer solution measured by NDJ-8S digital viscometer is 65,000 mPa.s.

Embodiment 2

[0021] Add 10.0g of 4,4'-diaminodiphenyl ether into a three-necked flask, then add 83g of N,N-dimethylacetamide, and stir to dissolve for 40min. After the dissolution is completed, 1.25 g of dimethyl pyromellitate and 9.8 g of pyromellitic dianhydride are added, the solid content of the solution is 20%, and the reaction is carried out at room temperature for 7 hours to obtain a polyamic acid copolymer.

[0022] Under the condition of 25°C, the viscosity of the copolymer solution measured by NDJ-8S digital viscometer is 54,000 mPa.s.

Embodiment 3

[0024] Add 10.0g of 4,4'-diaminodiphenyl ether into a three-necked flask, then add 83g of N,N-dimethylacetamide, and stir to dissolve for 40min. After the dissolution is complete, 2.5 g of dimethyl pyromellitate and 8.7 g of pyromellitic dianhydride are added, the solid content of the solution is 20%, and the reaction is carried out at room temperature for 7 hours to obtain a polyamic acid copolymer.

[0025] Under the condition of 25°C, the viscosity of the copolymer solution measured by NDJ-8S digital viscometer is 52,000 mPa.s.

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Abstract

The invention discloses a low-viscosity polyamide acid copolymer, a preparation method of the polyamide acid copolymer and a polyimide film. The method for preparing the low-viscosity polyamide acid copolymer comprises the following steps: carrying out a reaction of aromatic diamine, a diacid diester monomer and aromatic dianhydride in an aprotic polar solvent, thereby obtaining the product, wherein the diacid diester monomer is selected one or a combination of more than two of dimethyl phthalate, diethyl phthalate and dibutyl phthalate; the addition amount of the diacid diester is 5-30mol% of the usage amount of the aromatic dianhydride. Due to the addition of the diacid diester and the control of addition amount of the diacid diester relative to the aromatic dianhydride, the viscosity of the system is effectively regulated, and finally a polyimide prepolymer (the polyamide acid copolymer) with low viscosity is obtained, so that the leveling property and operability of the polyamide acid copolymer are improved, the drying and film-forming speed is high, and the finally prepared polyimide film has further excellent mechanical property and insulating property.

Description

technical field [0001] The invention relates to a polyimide film, in particular to a low-viscosity polyamic acid copolymer, a preparation method thereof and a polyimide film. Background technique [0002] Traditional polyimide films usually dissolve aromatic diamines in aprotic polar solvents, then add equimolar aromatic dianhydrides, and conduct condensation reactions at low or normal temperatures to form prepolymerized polyimides. Bulk polyamic acid resin solution, followed by defoaming, casting and thermal imidization. When the molecular weight of the obtained polyamic acid is too high, its viscosity is relatively high, which leads to poor leveling and poor operability. Properties of imine films. Therefore, it is necessary to properly control the molecular weight of polyamic acid to obtain good operability and to make the resulting polyimide film have excellent physical properties. Contents of the invention [0003] The technical problem to be solved by the present i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/06C08L79/08
CPCC08G73/1067C08J5/18C08J2379/08C08L79/08C08L2203/16
Inventor 刘业强王汝柯姬亚宁
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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