High temperature resistant adhesive for carbon materials and preparation method thereof

An adhesive, high temperature resistant technology, applied in the direction of adhesives, non-polymer adhesive additives, adhesive types, etc., can solve the problems of low electrical conductivity, low thermal conductivity, low bonding strength, etc., to achieve high applicable temperature, excellent electrical conductivity and thermal conductivity, solving the effect of low bonding strength

Inactive Publication Date: 2017-05-10
INNER MONGOLIA AEROSPACE HONGGANG MACHINERY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a high-temperature-resistant adhesive for carbon materials, so as to solve the problems of low bonding strength, low electrical and thermal conductivity of current high-temperature-resistant adhesives when applied above 800 °C

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Adhesive graphite and graphite materials can be used for a long time in the environment of 1400-1600 ℃ after bonding.

[0021] The designed adhesive is composed of silicon-titanium modified phenolic and composite fillers.

[0022] The composite filler is composed of boron powder, silicon powder, zirconium powder, zirconium boride powder and hexamethyltetramine. The ratio of boron powder, silicon powder, zirconium powder, zirconium boride powder and hexamethyltetramine is 30:20: 20:25:5, by manual stirring for 15-20 minutes, to obtain the composite filler.

[0023] Mix the silicon-titanium modified phenolic resin and the composite filler at a ratio of 100:75, and stir by hand for 5-10 minutes until the mixture is uniform to obtain an adhesive.

[0024] Apply the adhesive to the bonding surface of the graphite material, and carry out bonding, and squeeze to control the thickness of the adhesive layer at 0.15±0.02mm, then clean up the excess adhesive around the bonding su...

Embodiment 2

[0028] Adhesive C / C composite material and graphite material can be used for a long time in the environment of 1200-1400 ℃ after bonding.

[0029] The designed adhesive is composed of boron modified phenolic and composite fillers.

[0030] The composite filler is composed of boron powder and silicon powder, the ratio of boron powder and silicon powder is 60:40, and the composite filler is obtained by manual stirring for 15-20 minutes.

[0031] Mix the boron-modified phenolic resin and the composite filler in a ratio of 100:85, and stir by hand for 5-10 minutes until the mixture is uniform to obtain an adhesive.

[0032] Apply the adhesive to the bonding surface of the C / C composite material and the graphite material, and carry out bonding, and squeeze to control the thickness of the adhesive layer at 0.2±0.02mm, then clean up the excess adhesive around the bonding surface, and apply 0.2MPa pressure.

[0033] Then put it into the curing furnace, raise the temperature to 120°C...

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Abstract

The present invention relates to a high temperature resistant adhesive for carbon materials and a preparation method thereof. The high temperature resistant adhesive is composed of high residual carbon resi and a compound filler. The ratio of the high residual carbon resin to the compound filler is 100:(55-95). The high residual carbon resin comprises phenolic resin, furan resin, benzoxazine resin, etc. The compound filler consists of two or more of graphite powder, boron powder, boron carbide, boron nitride, zirconium powder, silicon powder, zirconium boride, zirconium oxide, etc., and a curing agent corresponding to the high residual carbon resin, and the compositions are selected according to use temperature of the materials to be adhered. The high temperature resistant adhesive has the characteristics of being high in applicable temperature and wide in temperature range, can be used for a long time at 800 DEG C or more, has excellent electrical and thermal conductivity at the high temperature, and effectively solves the problems that currently when the high temperature resistant adhesive is applied at 800 DEG C or more, the adhesive strength is relatively low, the electrical and thermal conductivity is low, etc.

Description

technical field [0001] The invention relates to a high-temperature-resistant adhesive, in particular to a high-temperature-resistant adhesive that can be used for bonding C / C composite materials, graphite, and pyrolytic graphite materials and a preparation method thereof. Background technique [0002] Carbon materials have excellent high-temperature performance and have extensive and important applications in high-temperature fields. However, the inherent brittleness of carbon materials makes it difficult to produce and process large-scale or complex-shaped products. Bonding technology can effectively solve the above problems. Graphite, C / C composites, and pyrolytic graphite, which are typical representatives of carbon materials, not only have excellent high-temperature thermophysical properties, but also have good electrical conductivity. [0003] At present, the commonly used high-temperature bonding mainly relies on inorganic ceramic high-temperature adhesives, but its b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J161/14C09J11/04C09J11/06C09J9/02
CPCC08K3/08C08K3/36C08K3/38C08K5/17C08K2201/014C09J9/02C09J11/04C09J11/06C09J161/14
Inventor 严科飞李婷拓亚亚魏晓婷陈孝鹏
Owner INNER MONGOLIA AEROSPACE HONGGANG MACHINERY
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