Organic silicon electronic pouring sealant with good ultraviolet-resisting cooling performance for PCB (Printed Circuit Board)

Abstract

The invention discloses an organic silicon electronic pouring sealant with good ultraviolet-resisting cooling performance for a PCB (Printed Circuit Board). The organic silicon electronic pouring sealant is prepared from the following raw materials in parts by weight: 40 to 50 parts of vinyl end silicone oil-1, 50 to 60 parts of vinyl end silicone oil-2, 0.38 to 0.5 part of 12 percent platinum catalyst, 0.02 to 0.04 part of ethynylcyclohexanol, 25 to 30 parts of vinyl silicone resin, 1-allyloxy-2, 14.8 to 16.8 parts of 3-epoxypropane 1, 23 to 25 parts of 1,3,5,7-tetramethylcyclotetrasiloxane, 2.7 to 3.6 parts of silane coupling agent A171, a proper amount of hydrogen-containing silicone oil, 3.4 to 4 parts of graphene, 0.2 to 0.4 part of silane coupling agent KH1510, a proper amount of acetone and a proper amount of deionized water. The pouring sealant prepared by the invention is simple in preparation process, wide in raw material source, high in operability and high in quality stability of a product; in addition, the pouring sealant has the advantages of excellent weather fastness, heat dissipation, corrosion resistance, high strength and the like, and is worthy of being popularized.

Description

technical field [0001] The invention relates to the technical field of potting glue for printed circuit boards, in particular to a silicone electronic potting glue for PCB circuit boards with good ultraviolet heat dissipation performance. Background technique [0002] With the rapid development of electronic science and technology, electronic components, devices, instruments and meters have been widely used in the electronic industry. Since the working environment of many electronic devices is complex and changeable, and sometimes even encounters extremely harsh natural conditions, in order to protect electronic components and integrated circuits from the working environment and improve the electrical performance and stability of electronic devices, it is necessary to The device is potted for protection. Potting is one of the important processes in the assembly of electronic devices. It is to fill the gaps of electronic devices with potting materials by mechanical or manual...

AI Technical Summary

Problems solved by technology

However, the potting compound synthesized in this article can not meet the requirements of the potting compound on the market for PCB circuit boards, and its performance is not high in all aspects, so it must be further improved to expand the scope of use.