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Sn plated stainless steel plate

A stainless steel plate and coating technology, applied in chemical instruments and methods, layered products, metal layered products, etc., can solve different problems and achieve excellent whisker resistance

Inactive Publication Date: 2018-03-27
NISSHIN STEEL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the mechanism of whisker formation from Sn plating has not been clearly analyzed, and the mechanism of whisker formation varies depending on the type of base material used, the thickness of the plating layer, and the surrounding environment.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Using the stainless steel plate A as the stainless steel plate, the stainless steel plate A was acid-washed under the following conditions after performing alkali degreasing on the stainless steel plate A under the following conditions.

[0051] [conditions for alkali degreasing]

[0052] · Degreasing solution: sodium orthosilicate 50g / L

[0053] · Degreasing conditions:

[0054] Liquid temperature: 60°C

[0055] Current density: 5A / dm 2

[0056] Electrolysis time: anode 5 seconds → cathode 5 seconds

[0057] [Conditions of pickling]

[0058] ·Pickling liquid: sulfuric acid 50g / L

[0059] ·Pickling conditions:

[0060] Liquid temperature: 50°C

[0061] Dipping time: 5 seconds

[0062] Next, Ni strike plating was performed on the stainless steel plate A after the pickling under the following conditions, whereby a Ni plating layer with a thickness of 1.0 μm was formed on the stainless steel plate A.

[0063] [Conditions for impact Ni plating]

[0064] Ni platin...

Embodiment 2

[0097] Like embodiment 1, wherein, use stainless steel plate B as stainless steel plate, change the film thickness of Ni plating layer and the film thickness of Sn plating layer as shown in Table 2, except that, carry out similarly with embodiment 1, make Sn plated stainless steel Plates were carried out in the same manner as in Example 1, and the lattice distortion rate of Ni crystals in the Ni plating layer of the obtained Sn-plated stainless steel plate and the characteristics of the Sn-plated stainless steel plate were examined. List the results in Table 2.

Embodiment 3～8

[0099] As shown in Table 2, using stainless steel plate A or stainless steel plate B as the stainless steel plate, except that the film thickness of the Ni plating layer formed by impact Ni plating was changed to 0.2 μm, it was carried out in the same manner as in Example 1. After forming the Ni strike plating layer on the surface of the plate, as the main Ni plating, Ni plating was performed under the following conditions, and the thickness of the overall Ni plating layer was adjusted as shown in Table 2, thereby forming a Ni plating layer on the surface of the stainless steel plate.

[0100] [Conditions for full-scale Ni plating]

[0101] Ni plating solution (watt bath): nickel sulfate 300g / L, nickel chloride 45g / L, boric acid 35g / L (pH: 3.9)

[0102] ·Plating conditions

[0103] Liquid temperature: 50°C

[0104]Current density: 8A / dm 2

[0105] Next, except adjusting the thickness of the Sn plating layer as shown in Table 2, it carried out similarly to Example 1, and pr...

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Abstract

The present invention is a tin-plated stainless steel plate having a tin plating layer with good adhesion to the stainless steel plate, excellent whisker resistance in various environments, and having a thickness of 0.3 to 3 μm formed on the stainless steel plate A nickel plating layer, on which a tin plating layer with a thickness of 0.3-5 μm is formed, is characterized in that the lattice distortion rate of nickel crystals in the nickel plating layer is 0.5% or less.

Description

technical field [0001] The present invention relates to a tin (Sn) plated stainless steel plate. More specifically, the present invention relates to a Sn-plated stainless steel plate that can be suitably used for electrical contact parts such as connectors, lead frames, harness plugs, etc. used in electrical equipment, electronic equipment, and the like. Background technique [0002] A material in which a Sn plating layer is formed on a Cu alloy material is widely used for electric contact parts. In recent years, in order to reduce the size and weight of contact parts, ordinary steel sheets and stainless steel sheets having higher material strength than Cu alloys have been used as base materials for Sn plating even if the sheet thickness is thin (for example, Patent Documents 1 to 4). Compared with ordinary steel plates, stainless steel plates have high material strength, and are suitable as a base material for Sn plating because they have excellent corrosion resistance on ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/26C25D5/12
CPCC25D3/12C25D3/30C25D5/36B32B15/015C25D5/12C25D5/617C25D5/611C25D7/0614C25D5/00
Inventor 西田义胜多多纳政义藤井孝浩平冈正司长尾雅央
Owner NISSHIN STEEL CO LTD
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