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Method for preparing ceramic bond superfine abrasive polishing disk through electrophoresis codeposition

A technology of electrophoretic co-deposition and ceramic binder, applied in electrolytic coatings, coatings, etc., can solve the problems of easy agglomeration of abrasives, and achieve the effect of low cost, simple process and solving agglomeration

Inactive Publication Date: 2017-05-17
HUAQIAO UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem that the abrasives are easy to agglomerate in the traditional powder metallurgy process to make bonded abrasives, and propose a method for preparing vitrified bond ultrafine abrasive polishing discs by means of electrophoretic co-deposition

Method used

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  • Method for preparing ceramic bond superfine abrasive polishing disk through electrophoresis codeposition
  • Method for preparing ceramic bond superfine abrasive polishing disk through electrophoresis codeposition
  • Method for preparing ceramic bond superfine abrasive polishing disk through electrophoresis codeposition

Examples

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Embodiment 1

[0026] Preparation of electrophoretic co-deposited vitrified bond superfine diamond abrasive polishing disc: the abrasive concentration in the composite coating on the prepared polishing disc is preset to be 50%, and the volume ratio of prepared diamond and ceramic powder is calculated to be 1:1, suspended Liquid concentration 0.1wt%. The particle size of diamond is 100nm, and the particle size of ceramic powder is 3 solution. Magnetically stir and ultrasonically disperse the configured composite suspension for 10 minutes each to make it evenly dispersed, and then pour it into the electrophoresis tank of the self-made electrophoresis device, wherein the bottom plate of the electrophoresis tank itself is used as the anode plate, and the stainless steel substrate is used as the cathode plate, Electrophoretic co-deposition. In the experiment, the deposition voltage was selected as 50V, the distance between the plates was 2cm, and the deposition time was 10min. After the electro...

Embodiment 2

[0028] Preparation of electrophoretic co-deposited vitrified bond ultrafine alumina polishing disc: the volume ratio of alumina abrasive and ceramic powder in the prepared composite coating is preset to be 1:2, and the concentration of the suspension is 1 wt%. Alumina has a particle size of 1 μm and ceramic powder has a particle size of 3 solution. Magnetically stir and ultrasonically disperse the configured composite suspension for 10 minutes each to make it evenly dispersed, and then pour it into the electrophoresis tank of the self-made electrophoresis device, wherein the bottom plate of the electrophoresis tank itself is used as the anode plate, and the stainless steel substrate is used as the cathode plate, Electrophoretic deposition. In the experiment, the deposition voltage was selected as 40V, the distance between the plates was 1.5cm, and the deposition time was 15min. After the electrophoretic deposition was completed, the circular substrate with the deposited coati...

Embodiment 3

[0030] Preparation of electrophoretic co-deposited vitrified bond ultrafine diamond alumina mixed abrasive polishing disc: pre-set the volume ratio of diamond, alumina and ceramic powder in the prepared composite coating to 1:1:5, and the suspension concentration is 0.5wt% . The particle size of the abrasive is 600nm, and the particle size of the ceramic powder is 3 ) 3 solution. Magnetically stir and ultrasonically disperse the configured composite suspension for 10 minutes each to make it evenly dispersed, and then pour it into the electrophoresis tank of the self-made electrophoresis device, wherein the bottom plate of the electrophoresis tank itself is used as the anode plate, and the stainless steel substrate is used as the cathode plate, Electrophoretic deposition. In the experiment, the deposition voltage was selected as 60V, the distance between the plates was 2cm, and the deposition time was 20min. After the electrophoretic deposition was completed, the circular su...

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Abstract

The invention provides a method for preparing a ceramic bond superfine abrasive polishing disk through electrophoresis codeposition. The method comprises the steps that firstly, superfine abrasives and superfine ceramic powder are added into an organic solvent and prepared to suspending liquid with the particles dispersing uniformly through magnetic stirring and ultrasonic dispersing; secondly, high valent metal cations are added into the suspending liquid to enable the particles dispersing uniformly to take positive charge; then, by means of the method of the electrophoresis codeposition, the charged particles in the solution are deposited uniformly on a negative pole base plate; and finally, the air dried base plate is placed in a case-type resistance furnace to be solidified and sintered, and the ceramic bond superfine abrasive polishing disk is prepared. The polishing disk preparation method is simple, feasible and low in cost. The superfine abrasives can be dispersed uniformly in a ceramic bond, the thickness of a coating is controllable, and the superfine abrasives can be deposited on a special-shaped base body. The polishing disk prepared by the method has good application prospects in the efficient and super-precision machining field of semiconductor wafers.

Description

[0001] The invention relates to a method for preparing ceramic bond superfine abrasive polishing discs by electrophoretic co-deposition, which belongs to the field of ultra-precision processing. Background technique [0002] With the rapid development of semiconductor technology and optoelectronic technology, the demand for hard and brittle materials such as single crystal silicon carbide and sapphire substrates has increased, and higher requirements have been put forward for their processing quality and processing efficiency. As an important link in the entire processing process, polishing is mainly used to reduce the surface roughness of the material and obtain a smooth and flat substrate without damage, which directly determines the quality of the device. [0003] Among the polishing methods for the above-mentioned hard and brittle materials, free abrasive polishing is commonly used at present. However, the trajectory of the abrasive grains in this polishing method is uncon...

Claims

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Application Information

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IPC IPC(8): C25D15/00
CPCC25D15/00
Inventor 陆静徐西鹏王艳辉罗求发
Owner HUAQIAO UNIVERSITY
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