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Pb-free Sn-Bi alloy solder and preparation method thereof

A lead-free solder, tin-bismuth alloy technology, used in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problems of poor reliability, easy peeling, unstable interface layer, etc. Good property, good wetting and spreading effect

Inactive Publication Date: 2017-05-24
ANHUI HUAZHONG WELDING MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a lead-free solder of a tin-bismuth alloy and a preparation method thereof, which solves the problems of poor reliability and easy peeling of the existing Sn-Bi solder due to unstable interface layer

Method used

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  • Pb-free Sn-Bi alloy solder and preparation method thereof

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Embodiment 1

[0017] This embodiment provides a lead-free solder of tin-bismuth alloy consisting of the following components by weight percentage: Bi17%, Ag0.5%, Fe0.2%, Zn0.2%, Sb0.2%, and the balance is Sn .

[0018] The preparation method of the lead-free solder of above-mentioned tin-bismuth alloy comprises the following steps:

[0019] (1) take Sn, Bi and Ag by proportioning, place in vacuum smelting furnace, prepare SnBiAg master alloy;

[0020] (2) Add the prepared SnBiAg master alloy, Fe, Zn and Sb into the vacuum melting furnace, cover the surface of the SnBiAg master alloy with an anti-oxidation solvent, heat the alloy to 350°C, keep it warm for 35min, remove the oxidized slag on the surface, and cast The alloy ingot is made in the mold, and further processed into filament products according to the process requirements.

Embodiment 2

[0022] This embodiment provides a lead-free solder of tin-bismuth alloy consisting of the following components by weight percentage: Bi16%, Ag0.8%, Fe0.1%, Zn0.3%, Sb0.1%, and the balance is Sn .

[0023] The preparation method of the lead-free solder of above-mentioned tin-bismuth alloy comprises the following steps:

[0024] (1) take Sn, Bi and Ag by proportioning, place in vacuum smelting furnace, prepare SnBiAg master alloy;

[0025] (2) Add the prepared SnBiAg master alloy, Fe, Zn and Sb into the vacuum melting furnace, cover the surface of the SnBiAg master alloy with an anti-oxidation solvent, heat the alloy to 250°C, keep it warm for 45min, remove the surface oxidation slag, and cast The alloy ingot is made in the mold, and further processed into strip products according to the process requirements.

Embodiment 3

[0027] This embodiment provides a lead-free solder of tin-bismuth alloy consisting of the following components by weight percentage: Bi18%, Ag0.3%, Fe0.3%, Zn0.1%, Sb0.3%, and the balance is Sn .

[0028] The preparation method of the lead-free solder of above-mentioned tin-bismuth alloy comprises the following steps:

[0029] (1) take Sn, Bi and Ag by proportioning, place in vacuum smelting furnace, prepare SnBiAg master alloy;

[0030] (2) Add the prepared SnBiAg master alloy, Fe, Zn and Sb into the vacuum melting furnace, cover the surface of the SnBiAg master alloy with an anti-oxidation solvent, heat the alloy to 400°C, keep it warm for 25min, remove the surface oxidation slag, and cast The alloy ingot is made in the mold, and further processed into sheet products according to the process requirements.

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Abstract

The invention discloses Pb-free Sn-Bi alloy solder and a preparation method thereof and belongs to the technical field of Pb-free new material manufacturing. The Pb-free Sn-Bi alloy solder comprises the following components in percentage by weight: 16-18% of Bi, 0.3-0.8% of Ag, 0.1-0.3% of Fe, 0.1-0.3% of Zn, 0.1-0.3% of Sb and the balance Sn. The melting point of the Pb-free Sn-Bi alloy solder is 156-165 DEG C and meets the welding temperature requirement of components in the microelectronic industry. Moreover, the Pb-free Sn-Bi alloy solder has good wettability and spreadability, high bonding strength and good ductility for various semiconductor materials with different properties in the microelectronic industry.

Description

technical field [0001] The invention relates to a lead-free solder, in particular to a lead-free solder for tin-bismuth alloy and a preparation method thereof, which belongs to the technical field of lead-free manufacturing of new materials. Background technique [0002] Lead is a harmful metal element. As early as 2003, the European Union's ROHS (Restriction of Hazardous Substances, referring to the directive on restricting the use of certain harmful components in electrical and electronic equipment) stipulated that electronic information products entering Europe should not contain lead and mercury. , cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated diphenyl ethers. In the past, tin-lead alloy solders were mostly used in the assembly and welding of electronic products and the production of electronic components. Although my country's lead-free solder field started relatively late, and there is still a gap compared with developed countries, in order ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262B23K35/0222
Inventor 刘东枭
Owner ANHUI HUAZHONG WELDING MATERIAL CO LTD
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