Continuous screen printing machine for ceramic substrate and printing method thereof

Abstract

The invention discloses a continuous screen printing machine for a ceramic substrate and a printing method thereof and relates to screen printing. The continuous screen printing machine for the ceramic substrate comprises a thin film conveying system, a printing system, a heat treatment system and a substrate film receiving system. The thin film conveying system, the printing system, the heat treatment system and the substrate film receiving system are arranged in sequence and placed on the ground. A transmission mechanism of the thin film conveying system is connected with the printing system and the heat treatment system. A locating mechanism is arranged between the printing system and the heat treatment system. A silicon carbide ceramic film is conveyed from the thin film conveying system, passes the locating mechanism, is conveyed to the printing system and the heat treatment system, passes the locating mechanism again and is reeled through the substrate film receiving system to form a finished substrate. Uniform coating of printing materials can be conducted on the surface of the silicon carbide ceramic film in a short time, and the printed printing materials are subjected to heat treatment and solidification, so that the silicon carbide ceramic film is made into the silicon carbide ceramic substrate with circuit patterns.

Description

technical field [0001] The invention relates to screen printing, in particular to a ceramic substrate continuous screen printing machine and a printing method thereof. Background technique [0002] With the development of electronic devices in the direction of high power, small size, and high-density packaging, heat dissipation has become a major bottleneck restricting the development of the industry. Electronic devices require the use of miniaturized components and circuit patterns, which greatly increases their power density, making it easy to generate and accumulate a large amount of heat when the device is working. If the heat cannot be transferred out in time through heat conduction, etc., it will seriously affect the performance and service life of the device. Therefore, electronic devices require the use of heat dissipation substrates with high thermal conductivity, high insulation, high mechanical properties and high flatness, and corresponding circuits should be fa...

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