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Organosilicone modified epoxy resin packaging material and LED packaging adhesive

A technology of epoxy resin and packaging material, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of low surface tension, performance degradation, surface pollution, etc., and achieve high light transmittance and high refractive index , The effect of good high and low temperature resistance

Inactive Publication Date: 2017-05-24
ZHENGZHOU ZHONGYUAN SILANDE HIGH TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the packaging material described in this patent may gradually migrate to the surface due to its low surface tension during use, causing performance degradation and surface contamination.

Method used

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  • Organosilicone modified epoxy resin packaging material and LED packaging adhesive

Examples

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Effect test

preparation example 1

[0070] Preparation Example 1: Preparation of Epoxy- and Vinyl-Containing Organosilicon Compounds—Epoxy Propoxy Propyl-Vinyl-Phenyl Silicone Resin

[0071] In a 2L four-necked flask with a stirring bar, a thermometer, and a condenser tube, drop 266.4g of KH560, 292.8g of diphenyldimethoxysiloxane, 216g of dimethyldimethoxysiloxane, 162g of Hexamethyldisiloxane and 37.2g of divinyltetramethyldisiloxane were stirred evenly, then 0.8336g of tetramethylammonium hydroxide and 216g of deionized water were added, and reacted in an ice-water bath for 2 hours. Then the temperature was raised to 90°C for 5h. After standing for stratification, the lower liquid was washed with water until neutral. Then, under vacuum, the temperature was raised to 100° C. to remove low molecules for 3 hours, and the target silicone resin product in the form of a colorless and transparent liquid was obtained. The measured viscosity of the product is 8000 mPa·s, the refractive index is 1.53, the vinyl conte...

preparation example 2

[0072] Preparation Example 2: Preparation of Epoxy- and Vinyl-Containing Organosilicon Compounds—Epoxycyclohexylethyl-Vinyl-Phenyl Silicone Resin

[0073] In a 2L four-necked flask with a stirring bar, a thermometer, and a condenser tube, drop 240.8g of 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane, 93g of phenyltrimethoxysilane Oxane, 162g hexamethyldisiloxane, 37.2g divinyltetramethyldisiloxane, stir evenly, add 0.8336g tetramethylammonium hydroxide and 216g deionized water, react in ice water bath for 2h . Then the temperature was raised to 90°C for 5h. After standing for stratification, the lower liquid was washed with water until neutral. Then, under vacuum, the temperature was raised to 100° C. to remove low molecules for 3 hours, and the target silicone resin product in the form of a colorless and transparent liquid was obtained. The measured viscosity of the product is 11000 mPa·s, the refractive index is 1.53, the vinyl content is 1.1%, and the epoxy group content is...

preparation example 3

[0074] Preparation Example 3: Preparation of Epoxy- and Vinyl-Containing Organosilicon Compounds—Epoxycyclohexylethyl-Vinyl-Phenyl Silicone Oil

[0075] Add 200g of octaphenylcyclotetrasiloxane, 50g of octamethylcyclotetrasiloxane, 20g of tetraepoxycyclohexylethyl-tetramethylsiloxane in the four-necked reaction flask equipped with stirring, thermometer and condenser Cyclotetrasiloxane (silane coupling agent X-40-2670, Japan Shin-Etsu Co.), 2.4g vinyl capping agent, then add 0.1g of potassium silanolate catalyst and 1g of dimethyl sulfoxide, heat up after closed reaction Stir, react at 150°C for 6 hours, cool down to 40°C and use excess propionic acid to neutralize, pressurize and filter to remove impurities, heat the filtrate to 200°C to remove low molecules in a vacuum to obtain a colorless, transparent, slightly odorous epoxy group Cyclohexylethyl-vinyl-phenyl silicone oil product. The measured viscosity of the product is 6000 mPa·s, the refractive index is 1.53, the mass c...

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Abstract

The invention provides an organosilicone modified epoxy resin packaging material and an LED packaging adhesive. The packaging material comprises a component A and a component B; the component A includes an organosilicon compound containing an epoxy group and vinyl and epoxy resin; the component B includes an organosilicon compound containing active hydrogen and anhydride. The packaging adhesive prepared from the organosilicone modified epoxy resin packaging material is high in refractive index, high in light transmittance and good in storage stability, has the good high and low temperature resistant performance, UV resistant performance and cold and heat shock resistant performance, and can meet the performance requirement of full color RGB white-light LED packaging for outdoor and indoor LED display screens.

Description

technical field [0001] The invention relates to an LED packaging material and a packaging glue, in particular to an organic silicon modified epoxy resin packaging material and an LED packaging glue prepared from the packaging material. Background technique [0002] Compared with traditional lighting equipment, LED has the advantages of simple structure, low power, high luminous efficiency, low energy consumption, long service life, and no mercury pollutants. It is a new generation of green environmental protection products and has been widely used in LED lighting, LED backlight, LED display and other fields. LED encapsulant mainly plays a key role in protecting the chip and taking out light. In addition to good mechanical properties, it should also have excellent optical properties such as high refractive index and light transmittance, as well as good heat resistance, UV resistance, Weather resistance, low water vapor transmission rate and other aging resistance. [0003] ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J183/06C09J183/07C09J183/05C08G77/20C08G77/14H01L33/56
CPCC09J163/00C08G77/14C08G77/20C08L2201/08C08L2203/206C08L2205/02C08L2205/03C09J183/06H01L33/56C08L83/06C08L83/04C08L63/00
Inventor 胡生祥张燕秦瑞瑞赤建玉曹兴园宫祥怡吴欢屈雪艳邱凯杨忠奎
Owner ZHENGZHOU ZHONGYUAN SILANDE HIGH TECH CO LTD
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