Organosilicone modified epoxy resin packaging material and LED packaging adhesive

A technology of epoxy resin and packaging material, applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of low surface tension, performance degradation, surface pollution, etc., and achieve high light transmittance and high refractive index , The effect of good high and low temperature resistance

Inactive Publication Date: 2017-05-24
ZHENGZHOU ZHONGYUAN SILANDE HIGH TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the packaging material described in this patent may gradually migrate to the surface due

Method used

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  • Organosilicone modified epoxy resin packaging material and LED packaging adhesive

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Example Embodiment

[0070] Preparation Example 1 Preparation of epoxy- and vinyl-containing organosilicon compound-epoxy propoxypropyl-vinyl-phenyl silicone resin

[0071] Put 266.4g KH560, 292.8g diphenyldimethoxysiloxane, 216g dimethyldimethoxysiloxane, 162g into a 2L four-necked flask equipped with a stir bar, thermometer, and condenser. Hexamethyldisiloxane, 37.2g divinyltetramethyldisiloxane, after stirring evenly, 0.8336g of tetramethylammonium hydroxide and 216g of deionized water are added, and the reaction is carried out in an ice water bath for 2h. Then the temperature was raised to 90°C for 5h. After standing for stratification, wash the lower liquid with water until it is neutral. Then, under vacuum, the temperature is raised to 100° C. to remove low molecules for 3 hours to obtain a colorless and transparent liquid target silicone resin product. The measured product viscosity is 8000 mPa·s, the refractive index is 1.53, the vinyl content is 1.30%, and the epoxy group content is 0.16 m...

Example Embodiment

[0072] Preparation Example 2 Preparation of epoxy- and vinyl-containing organosilicon compound—epoxycyclohexylethyl-vinyl-phenyl silicone resin

[0073] Put 240.8g of 2-(3,4-epoxycyclohexyl)ethyltriethoxysilane and 93g of phenyltrimethoxysilane into a 2L four-necked flask equipped with a stir bar, thermometer, and condenser. Oxyane, 162g hexamethyldisiloxane, 37.2g divinyltetramethyldisiloxane, stir well, add 0.8336g tetramethylammonium hydroxide and 216g deionized water, and react in an ice water bath for 2h . Then the temperature was raised to 90°C for 5h. After standing for stratification, wash the lower liquid with water until it is neutral. Then, under vacuum, the temperature is raised to 100° C. to remove low molecules for 3 hours to obtain a colorless and transparent liquid target silicone resin product. The measured product viscosity is 11000 mPa·s, the refractive index is 1.53, the vinyl content is 1.1%, and the epoxy group content is 0.12 mol / 100g.

Example Embodiment

[0074] Preparation Example 3 Preparation of epoxy- and vinyl-containing organosilicon compound—epoxycyclohexylethyl-vinyl-phenyl silicone oil

[0075] Add 200g of octaphenylcyclotetrasiloxane, 50g of octamethylcyclotetrasiloxane, and 20g of tetraepoxycyclohexylethyl-tetramethyl into a four-necked reaction flask equipped with stirring, thermometer and condenser. Cyclotetrasiloxane (silane coupling agent X-40-2670, Japan Shin-Etsu Corporation), 2.4g vinyl capping agent, then add 0.1g potassium silanolate catalyst and 1g dimethyl sulfoxide, and heat up after the airtight reaction Stir, react at 150°C for 6h, cool to 40°C, neutralize with excess propionic acid, filter under pressure to remove impurities, heat the filtrate to 200°C to remove low molecules in vacuum to obtain a colorless, transparent, slightly odorous epoxy group Cyclohexylethyl-vinyl-phenyl silicone oil products. The measured product viscosity is 6000 mPa·s, the refractive index is 1.53, the vinyl mass content is 0.3...

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Abstract

The invention provides an organosilicone modified epoxy resin packaging material and an LED packaging adhesive. The packaging material comprises a component A and a component B; the component A includes an organosilicon compound containing an epoxy group and vinyl and epoxy resin; the component B includes an organosilicon compound containing active hydrogen and anhydride. The packaging adhesive prepared from the organosilicone modified epoxy resin packaging material is high in refractive index, high in light transmittance and good in storage stability, has the good high and low temperature resistant performance, UV resistant performance and cold and heat shock resistant performance, and can meet the performance requirement of full color RGB white-light LED packaging for outdoor and indoor LED display screens.

Description

technical field [0001] The invention relates to an LED packaging material and a packaging glue, in particular to an organic silicon modified epoxy resin packaging material and an LED packaging glue prepared from the packaging material. Background technique [0002] Compared with traditional lighting equipment, LED has the advantages of simple structure, low power, high luminous efficiency, low energy consumption, long service life, and no mercury pollutants. It is a new generation of green environmental protection products and has been widely used in LED lighting, LED backlight, LED display and other fields. LED encapsulant mainly plays a key role in protecting the chip and taking out light. In addition to good mechanical properties, it should also have excellent optical properties such as high refractive index and light transmittance, as well as good heat resistance, UV resistance, Weather resistance, low water vapor transmission rate and other aging resistance. [0003] ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J183/06C09J183/07C09J183/05C08G77/20C08G77/14H01L33/56
CPCC09J163/00C08G77/14C08G77/20C08L2201/08C08L2203/206C08L2205/02C08L2205/03C09J183/06H01L33/56C08L83/06C08L83/04C08L63/00
Inventor 胡生祥张燕秦瑞瑞赤建玉曹兴园宫祥怡吴欢屈雪艳邱凯杨忠奎
Owner ZHENGZHOU ZHONGYUAN SILANDE HIGH TECH CO LTD
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