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MEMS omnidirectional vibration sensing device

A technology of vibration sensing and vibration sensor, which is applied in the field of MEMS omnidirectional vibration sensing devices, can solve the problems of not being able to effectively acquire blasting vibration signal vector information suitable for variable burial, reduce complexity and volume, increase resonance frequency, and realize The effect of omnidirectional reception

Inactive Publication Date: 2017-05-24
罗雷
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is how to overcome the existing defects such as no vibration sensor suitable for buried underground and effectively obtaining blasting vibration signal vector information

Method used

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  • MEMS omnidirectional vibration sensing device

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Such as figure 1 As shown, the present invention provides a MEMS omnidirectional vibration sensing device, including a base 5, a printed circuit board 3, a MEMS-level three-axis capacitive accelerometer 2, a MEMS-level three-axis magnetoresistive sensor 1, and a three-dimensional acceleration sensor 4. The base 5 is spherical and composed of potting materials. The MEMS-level three-axis capacitive accelerometer 2 is installed at the center of gravity of the base 5 for three-dimensional omnidirectional vibration measurement. The three-axis capacitive accelerometer 2, the MEMS-level three-axis magnetoresistive sensor 1 and the three-dimensional acceleration sensor 4 are mounted on the printed circuit board 3; the printed circuit board 3 is directly cast on the base 5 by potting and molding processes In the plane of the center of gravity.

[0026] The diameter of the base 5 is 3 cm.

[0027] The printed circuit board includes a spiral initialization coil, the MEMS-level three-...

Embodiment 2

[0034] Such as figure 1 As shown, the present invention provides a MEMS omnidirectional vibration sensing device, including a base 5, a printed circuit board 3, a MEMS-level three-axis capacitive accelerometer 2, a MEMS-level three-axis magnetoresistive sensor 1, and a three-dimensional acceleration sensor 4. The base 5 is spherical and composed of potting materials. The MEMS-level three-axis capacitive accelerometer 2 is installed at the center of gravity of the base 5 for three-dimensional omnidirectional vibration measurement. The three-axis capacitive accelerometer 2, the MEMS-level three-axis magnetoresistive sensor 1 and the three-dimensional acceleration sensor 4 are mounted on the printed circuit board 3; the printed circuit board 3 is directly cast on the base 5 by potting and molding processes In the plane of the center of gravity.

[0035] The diameter of the base 5 is 4 cm.

[0036] The printed circuit board includes a spiral initialization coil, the MEMS-level three-...

Embodiment 3

[0043] Such as figure 1 As shown, the present invention provides a MEMS omnidirectional vibration sensing device, including a base 5, a printed circuit board 3, a MEMS-level three-axis capacitive accelerometer 2, a MEMS-level three-axis magnetoresistive sensor 1, and a three-dimensional acceleration sensor 4. The base 5 is spherical and composed of potting materials. The MEMS-level three-axis capacitive accelerometer 2 is installed at the center of gravity of the base 5 for three-dimensional omnidirectional vibration measurement. The three-axis capacitive accelerometer 2, the MEMS-level three-axis magnetoresistive sensor 1 and the three-dimensional acceleration sensor 4 are mounted on the printed circuit board 3; the printed circuit board 3 is directly cast on the base 5 by potting and molding processes In the plane of the center of gravity.

[0044] The diameter of the base 5 is 5 cm.

[0045] The printed circuit board includes a spiral initialization coil, the MEMS-level three-...

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Abstract

The invention discloses an MEMS omni-directional vibration sensing device, which comprises a base, a printed circuit board, an MEMS triaxial capacitive accelerometer, an MEMS triaxial magnetoresistive sensor and a three-dimensional acceleration sensor, and is characterized in that the base is spherical and made of an encapsulating material, the MEMS triaxial capacitive accelerometer is mounted at the gravity center of the base and used for three-dimensional omnidirectional vibration measurement, and the MEMS triaxial capacitive accelerometer, the MEMS triaxial magnetoresistive sensor and the three-dimensional acceleration sensor are mounted on the printed circuit board. By the aid of encapsulating and molding processes, the printed circuit board is directly cast in a gravity plane of the base. The base and soil particles synchronously vibrate, the density uniformity and the isotropic homogeneity of a sensor shell are ensured by selection of the printed circuit board and the encapsulating material, and omnidirectional receiving of blasting vibration signals is realized.

Description

Technical field [0001] The invention relates to the field of sensors for locating distributed seismic sources in shallow underground layers, in particular to a MEMS omnidirectional vibration sensing device. Background technique [0002] The shallow underground distributed seismic source location technology is to bury a large number of sensor nodes at different depths underground in the near-field monitoring area of ​​the underground seismic source, and through the wireless network composed of self-organization and multi-hop methods, cooperatively sense, monitor, collect, process and process. Transmit the vibration signal generated by the seismic source and analyze the characteristics of the seismic information collected by each node to realize the location of the seismic source. [0003] Compared with large-area, large-equivalent, large-depth seismic monitoring such as earthquakes, deep coal mining, and petroleum exploration, the location of distributed seismic sources in shallow u...

Claims

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Application Information

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IPC IPC(8): G01V1/18
CPCG01V1/189
Inventor 罗雷
Owner 罗雷
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