Porous substrate and manufacturing method thereof and manufacturing method of thin film transistor

Abstract

The invention discloses a manufacturing method of a thin film transistor. The manufacturing method comprises the steps that S1, filling material is filled in the holes of a porous substrate so as to acquire a bearing substrate; S2, a flexible film layer is prepared on the bearing substrate; S3, the filling material is removed; S4, an organic light-emitting diode is prepared on the flexible film layer; and S5, the porous substrate is removed so as to acquire the thin film transistor. According to the manufacturing method of the thin film transistor, bubbles generated in the OLED preparation process can be released due to existence of micropores based on the porous substrate having a micropore structure so that the illumination effect of the bubbles on the Array manufacturing process and damage of a vapor plating metal mask plate can be avoided, and the step of removing a sacrificial layer through laser irradiation and the heating step of the conventional manufacturing method can also be omitted. The invention also discloses the porous substrate used by the manufacturing method and the manufacturing method thereof. The porous substrate has no damage after use and can be repeatedly used so that pollution and waste can be reduced and the manufacturing cost of the thin film transistor can be reduced.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a porous substrate and a manufacturing method thereof, as well as a method for manufacturing a thin film transistor using the porous substrate. Background technique [0002] At present, the preparation method of flexible OLED devices usually uses a glass substrate as a carrier, and goes through the following main steps: (1) coating a layer of special adhesive on the surface of the glass substrate, or depositing a layer of inorganic substances as a sacrificial layer; (2) The sacrificial layer is coated with polymer monomers, polymers or a mixed solution of monomers and prepolymers, and the monomers are polymerized into a flexible film layer by baking and other processes; (3) Depositing a water-oxygen barrier on the surface of the flexible film layer (4) Perform Array manufacturing process, evaporation and packaging process to complete the preparation of flexible...

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Problems solved by technology

[0003] However, there are many defects in the above-mentioned existing technology: (a) During the preparation process of the flexible film layer, gas is easily mixed between the flexible film layer and the glass substrate, and bubbles will be generated in the later Array process and the baking process before evaporation. It will cause light defects in the Array manufacturing process and damage to the mask during the evaporation process; (b) when the flexible OLED device is irradiated by laser light, a large amount of heat will be generated on the surface of the flexible OLED device, which will cause thermal damage to the flexible OLED device Risk; (c) The material of the flexible film layer is mainly polymer, which has a large difference in thermal expansion coefficient between it and the metal electrode on its surface, and there is a risk of peeling off the metal electrode and the flexible film layer; (d) When the laser is irradiated, the laser may pass through the glass substrate and affect the organic light-emitting materials on the glass substrate, such as decomposition, crystallization, etc., especially for bottom-emitting devices; (e) the high price of laser equipment, for mass production line requires a large investment

[0004] Although it is currently possible to use a carrier substrate made of waterproof and breathable materials to overcome the above-mentioned problem of air bubbles, in this technical solution, it is necessary to prepare a flexible film layer in advance, and then use an adhesive to attach it to the surface of the carrier substrate; There are many micropores on the substrate for releasing air bubbles, so the flexible film layer cannot be directly coated on the carrier substrate, and the flexible substrate and the carrier substrate can only be bonded together, which not only increases the complexity of the process, but also The flatness of the flexible film layer has also been greatly challenged; and, because the flexible film layer in the Array process will withstand a high temperature of up to 450 ° C, and due to the light transmittance of the carrier substrate and the scattering of laser light, the carrier substrate It is not suitable for laser peeling method, only heating or mechanical peeling method can be used, which will cause the problem of residual glue cleaning, so this technical solution has high requirements for the carrier substrate and adhesive

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