Variable coding method for implementing chip reuse and communication terminal thereof
一种编码方法、芯片的技术,应用在可变编码,通信终端领域,能够解决适用范围有限、抗干扰问题难以解决等问题,达到降低开发成本、简化芯片种类的效果
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0039] figure 1 It is a system block diagram of a radio frequency power amplifier (PA) and a radio frequency switch module used in a communication terminal. Among them, the RF front-end uses two single-pole five-throw (SP5T) RF switch chips, their working principle is the same, and the source (CMOS Controller) of the logic input signals VC1-VC4 used to control them is also the same. However, since the integrated circuit system requires these two RF switch chips to undertake the work of switching RF signals in different frequency bands (such as high frequency band and low frequency band), they are irreplaceable from the system level and must coexist. Circuit chips, but the only difference between them is the truth table of their control logic.
[0040] Such as figure 2 As shown, the control logic truth tables defined by the integrated circuit system for the high frequency band (HB) and the low frequency band (LB) are different. In order to realize these functions, two diffe...
Embodiment 2
[0048] Such as Figure 7 As shown, in another embodiment of the present invention, in the circuit design stage, the input terminal of the logic control signal Vctrl is pulled up to the power supply (VDD) terminal through a slightly larger resistor, and then applied to the high frequency band (HB) radio frequency The Vctrl pin of the RF switch chip A of the signal can be suspended (it does not need to be connected to a fixed level in the packaging stage), at this time, only the Vctrl pin of the RF switch chip B needs to be connected to the ground (GND) terminal, thereby reducing A wire (Wire Bonding) to the power supply (VDD) terminal.
[0049] The pull-up resistors mentioned here are not limited to passive thin-film resistors, and may also be various types of transistors with appropriate bias states. The selection of its resistance value or equivalent resistance needs to be considered in a compromise: it is necessary to consider the strength of the pull-up to resist interfere...
Embodiment 3
[0051] Such as Figure 8 As shown, in another embodiment of the present invention, the input terminal of the logic control signal Vctrl is pulled down to the ground (GND) end through a slightly larger resistor, and then the radio frequency switch chip applied to the low frequency band (LB) radio frequency signal The Vctrl pin of B can be suspended (it does not need to be connected to a fixed level in the packaging stage), at this time, only the Vctrl pin of the RF switch chip A needs to be connected to the power supply (VDD) terminal, thus reducing the one to the ground ( GND) end of the wire (Wire Bonding).
[0052] The pull-down resistors mentioned here are not limited to passive thin-film resistors, and may also be various types of transistors with appropriate bias states. The selection of its resistance value or equivalent resistance value needs to be considered in a compromise: it is necessary to consider the strength of the pull-down to resist interference, which requir...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com