Damp-proof graphene heat dissipation film

Abstract

The invention provides a moisture-proof graphene heat dissipation film, which comprises a release film layer (1), a thermally conductive adhesive layer (2), a graphene heat dissipation layer (3), an isolation coating (4), and a polyester film from top to bottom A substrate layer (5), a water-absorbing resin layer (6). The heat dissipation layer (3) containing graphene is used as the main structure, the polyester film substrate layer (5) is used as the supporting layer structure, and the isolation coating (4) is coated on one side of the polyester film substrate layer (5), A water-absorbing resin layer (6) is provided on the other side of the polyester film base material layer (5). The moisture-proof graphene heat dissipation film of the present invention has good heat dissipation effect and high temperature resistance, and is provided with an isolation coating (4) to control high temperature. The small molecule migration inside the polyester film has good moisture-proof effect and strong weather resistance.

Description

technical field [0001] The invention relates to the field of heat dissipation materials, in particular to a moisture-proof graphene composite heat dissipation film. Background technique [0002] With the application of microelectronics technology, electronic products are developing in two directions: on the one hand, the integration of products is getting higher and higher, and the power consumption is increasing; on the other hand, products are getting lighter, thinner and smaller. This makes the heat dissipation contradiction of the product more and more prominent. Heat dissipation of electronic products is often a key factor restricting product reliability. [0003] At present, integrated circuits have entered the nanometer era. At the nanometer level, the thermal stability of metals decreases and the resistivity increases, which will affect the heat dissipation performance of integrated circuits. Among the traditional metal materials, the thermal conductivity of copper...

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Problems solved by technology

[0005] Patent document CN 104057653 A discloses a graphite film / metal composite heat sink and its preparation method. The heat sink is composed of a high thermal conductivity graphite film, a heat conductive adhesive layer and a metal layer through a rewinding machine, which improves the heat conduction and heat dissipation. ability, but this tape, like many other tapes, only provides a heat dissipation effect, and has poor weather resistance, which affects the use effect of the heat dissipation film in a humid environment

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