Radio frequency chip connecting piece assembly and preparation technology thereof

Abstract

The invention discloses a radio frequency chip connecting piece assembly and a preparation technology thereof, and belongs to the technical field of radio frequency. The radio frequency chip connecting piece assembly comprises a PET (polyethylene terephthalate)-aluminum foil composite film and a radio frequency chip, wherein the PET-aluminum foil composite film comprises a chip pile leg connecting aluminum foil and a PET bottom film; the radio frequency chip is fixedly and electrically connected with the chip pile leg connecting aluminum foil. The preparation technology comprises the following steps of manufacturing of the PET-aluminum foil composite film, laser cutting, stripping of an unused aluminum foil, and the like. The radio frequency chip connecting piece assembly has the advantages that by adopting the laser aluminum foil cutting technology, the wastewater is not produced, the technology is simple, and the manufacturing cost is low; the chip connecting piece is not provided with the PET film, so that the surfaces of the chip and an antenna embedding body (INLAY) are flat in installation, the bulge of the PET film is avoided, and the whole thickness is little.

Description

technical field [0001] The invention relates to the field of radio frequency technology, in particular to a radio frequency chip connecting piece assembly and a preparation process thereof. Background technique [0002] The traditional chip connection sheet uses PET composite aluminum foil film. During the production process of the chip connection sheet of this structure, the useless aluminum foil is etched away by the chemical fluid through the chemical etching process, and the remaining aluminum foil pattern becomes the electrical connection sheet of the chip pin. This chemical etching processing method has the following defects: the use of chemical fluids to corrode the aluminum foil produces a large amount of waste water to pollute the environment; After forming and pressing on the RF antenna, the thickness of the PET base film is more than 40 microns higher than the antenna, resulting in a 40 micron high protrusion on the surface of the RF antenna-chip inlay (INLAY), w...

AI Technical Summary

Problems solved by technology

This chemical etching processing method has the following defects: the use of chemical fluids to corrode the aluminum foil produces a large amount of waste water to pollute the environment; After forming and pressing on the RF antenna, the thickness of the PET base film is more than 40 microns higher than the antenna, resulting in a 40 micron high protrusion on the surface of the RF antenna-chip inlay (INLAY), which affects the finished product (such as a radio frequency label) surface smoothness and appearance

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