Machining method of high-precision local ultra-high current printed circuit board

A printed circuit board, high-precision technology, used in printed circuits, printed circuit manufacturing, multi-layer circuit manufacturing, etc., can solve the problems of excessive ink thickness, excessive line width tolerance, thin ink thickness, etc., to achieve production. The effect of smooth process, increased order-taking ability, and improved economic benefits

Inactive Publication Date: 2017-06-13
KUNSHAN SUHANG CIRCUIT BOARD
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Problems solved by technology

However, the production process of traditional circuit boards has been unable to realize the production of such circuit boards. Using the traditional circuit board production process to produce such circuit boards will cause the line width tolerance on both sides to be seriously out of tolerance, one side is too

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  • Machining method of high-precision local ultra-high current printed circuit board

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[0008] The present invention will be described in detail with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following embodiments, that is, all simple equivalent changes and modifications made based on the scope of the patent application of the present invention and the contents of the description shall still belong to the patent of the present invention. Within the scope of coverage.

[0009] See attached figure 1 , Is a high-precision local ultra-high current printed circuit board made by the method of the present invention, that is, an anode and cathode copper thick printed board structure, including a substrate 2 and thin copper layers respectively arranged on both sides of the substrate 1 and thick copper layer 3. When making the outer circuit of this board, dry film is applied on both sides first, and the thin copper layer 1 side is aligned and exposed and developed with the circuit, and the thick copper ...

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Abstract

The invention discloses a method for processing a high-precision local ultra-high current printed circuit board. The printed circuit board includes a substrate and thin copper layers and thick copper layers respectively arranged on both sides of the substrate. When making outer-layer circuits, First, a layer of dry film is applied to the thick copper layer for protection, and the thin copper layer is exposed, developed, electroplated, and etched to produce a thin copper layer circuit pattern; then a layer of dry film is applied to the thin copper layer circuit pattern Protection, and the thick copper layer is made into a thick copper layer circuit pattern through exposure, development, electroplating, and etching processes. The high-precision local ultra-high-current printed circuit board processing method adopts facet-time production lines and facet-time etching and separate times to make solder resists, making it possible for yin and yang copper thick printed boards. The reform of the method makes the product quality fully meet the customer's requirements, and can meet the customer's demand for special printed boards, which increases the market's ability to receive orders and improves economic benefits.

Description

technical field [0001] The invention relates to a method for processing a printed circuit board, in particular to a method for processing a high-precision local ultra-high current printed circuit board. Background technique [0002] In recent years, the development of acoustic equipment and electric vehicles has become more and more sophisticated, and the required electronic components have become smaller and smaller, and some parts require the support of large currents. However, the production process of traditional circuit boards has been unable to realize the production of such circuit boards. Using the traditional circuit board production process to produce such circuit boards will cause the line width tolerance on both sides to be seriously out of tolerance, one side is too small due to excessive etching, and On one side, due to insufficient etching, the short circuit or the circuit is too large. At the same time, the solder mask will also have technical problems such a...

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4644H05K2203/1476
Inventor 倪蕴之朱永乐黄坤
Owner KUNSHAN SUHANG CIRCUIT BOARD
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