Polyimide film with high dimensional stability and preparation method of polyimide film

A polyimide film, dimensionally stable technology, applied in the field of polymer polymer materials, can solve the problems of insufficient downstream use, complicated production process, etc., and achieve the effect of good molecular orientation

Active Publication Date: 2017-06-27
RAYITEK HI TECH FILM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent improves the performance of the film by adding a new physical mechanism, making full use of the existing production line equipment, but the method still makes the production process complicated, and the new equipment puts forward requirements for the space o

Method used

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  • Polyimide film with high dimensional stability and preparation method of polyimide film
  • Polyimide film with high dimensional stability and preparation method of polyimide film
  • Polyimide film with high dimensional stability and preparation method of polyimide film

Examples

Experimental program
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Example Embodiment

[0041] Film preparation method

[0042] 1. Synthesis of resin

[0043] The preparation of the polyamic acid resin solution of the present invention adopts the well-known preparation method of the polyamic acid resin, that is, the aromatic dianhydride and the aromatic diamine are based on the molar ratio of moles of anhydride group: moles of amino group = 1:1. The polymerization reaction is carried out in a solvent of 2 to 8 times the total weight of the two, and the necessary additives for film smoothing and film forming can be added for the application of the film after film formation. These smooth and film forming additives can be commercial products. , Obtain the polyamic acid resin solution, enter the salivation process after vacuum defoaming;

[0044] 2. Steel belt salivation

[0045] The polyamic acid resin solution is salivated on the endless steel belt to obtain a gel film of polyamic acid resin with a solvent content of 15-50%;

[0046] 3. Vertical pulling treatment

[0047] T...

Example Embodiment

[0056] Example 1

[0057] Pyromellitic dianhydride, 4.4' diaminodiphenyl ether and p-phenylenediamine were reacted in dimethylacetamide at a molar ratio of 1:0.4:0.6 to prepare 100kg of polyamic acid resin solution, viscosity 100,000 cps, solid content 20%.

[0058] Based on the total amount of pyromellitic dianhydride, 4.4' diaminodiphenyl ether, and p-phenylenediamine, a silica filler of 1.5% of the total amount of dianhydride and diamine is added to the solution in advance.

[0059] According to the amount of pyromellitic dianhydride, phthalic anhydride is added in an amount of 0.01% by mole.

[0060] High-speed stirring and dispersion method is adopted to prepare polyamic acid resin.

[0061] The obtained polyamic acid resin is transported to the salivation die through a pipeline, and then passes through an endless steel belt. The pulling tension is set to 150N, and the solvent content of the salivation gel film is controlled to 25%. Under this formula and thickness, the K value is...

Example Embodiment

[0143] Example 2

[0144] Pyromellitic dianhydride, 4,4'-diaminodiphenyl ether, and p-phenylenediamine are reacted in methylformamide at a molar ratio of 1:0.4:0.6 to prepare 100 kg of polyamic acid resin solution , The viscosity is 100,000 centipoise, and the solid content is 20%.

[0145] Based on the total amount of pyromellitic dianhydride, 4.4' diaminodiphenyl ether, and p-phenylenediamine, a silica filler of 1.5% of the total amount of dianhydride and diamine is added to the solution in advance.

[0146] According to the amount of pyromellitic dianhydride, phthalic anhydride is added in an amount of 0.01% by mole.

[0147] High-speed stirring and dispersion method is adopted to prepare polyamic acid resin.

[0148] The obtained polyamic acid resin is transported to the salivation die through a pipeline, and then passes through an endless steel belt. The traction tension is set to 150N, and the solvent content of the salivation gel film is controlled to 25%. With this formula and ...

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Abstract

The invention discloses a polyimide film with high dimensional stability and a preparation method of the polyimide film. The polyimide film is prepared from at least one aromatic dianhydride containing a rigid structure and at least one aromatic diamine containing a rigid structure through a solution polycondensation reaction and an imidization reaction, wherein the sum of mole numbers of the aromatic dianhydride containing the rigid structure and the aromatic diamine containing the rigid structure accounts for 70-85% of the sum of mole numbers of totally reacted dianhydrides and diamines; the film thickness is 5-75 microns; the thermal shrinkage ratios of the film in the longitudinal direction and the transverse direction are respectively less than or equal to 0.1%; the coefficient of linear thermal expansion is less than or equal to 16ppm; and the operating requirements of a polyimide film base material of a flexible copper clad laminate are met. According to the preparation process of the film, a roll-to-roll production manner of performing continuous longitudinal stretching technology according to a constant speed ratio and transverse high-temperature stretching and online thermosetting treatment is adopted, the prepared polyimide film has excellent dimensional stability performance, and the production manner adopted by the film is simple, convenient, high-efficiency and reliable.

Description

technical field [0001] The invention relates to the field of high molecular polymer materials, and more specifically relates to a highly dimensionally stable polyimide film material. Background technique [0002] With the development of miniaturization and thinning of electronic equipment, the rapid development of high-density internal flexible circuit board (FPC) wiring patterns and high-density assembly of electronic devices on circuit boards, polyimide films as flexible circuit substrates Higher requirements are put forward in terms of dimensional stability, and the thermal shrinkage rate of the film is required to be ≤0.1%, and the linear thermal expansion coefficient is ≤16ppm. However, in terms of dimensional stability, such as thermal shrinkage rate and linear thermal expansion It is difficult to meet the requirements of flexible circuit substrates at the same time. [0003] In the field of flexible circuit boards, the heat shrinkage test of polyimide substrate is a ...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08G73/10
CPCC08G73/1067C08J5/18C08J2379/08
Inventor 何志斌袁舜齐徐飞柳南舟
Owner RAYITEK HI TECH FILM CO LTD
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