Novel consolidated nano-diamond butadiene grinding disc and preparation technology thereof

A technology of nanodiamondene and grinding discs, which is applied in the field of grinding and polishing, can solve the problems of workpiece cleaning and subsequent processing, poor overall planarization effect, and difficult control of processing technology, etc., and achieves low cost, convenient cleaning and processing, and abrasive utilization. high rate effect
CN106926114AInactive Publication Date: 2017-07-07ZHENGZHOU ARTIFICIAL DIAMOND & PROD ENG TECH RES CENT
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
ZHENGZHOU ARTIFICIAL DIAMOND & PROD ENG TECH RES CENT
Publication Date
2017-07-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

A novel consolidated nano-diamond butadiene grinding disc is manufactured by a basic raw material and added nano-diamond butadiene, wherein the basic raw material is prepared from the following components in percentage by weight: 55-60% of modified E-54 epoxy resins and methyl tetrahydrophthalic anhydride, 0.5-1% of N,N-dimethylbenzylamine, 3.5-4% of a plasticizer, 30-35% of a filler and 5-6% of a pore-forming agent, the addition quantity of the nano-diamond butadiene is 15-33wt% of the basic raw material, and the mass ratio of E-54 epoxy resins to methyl tetrahydrophthalic anhydride is 10:9. The consolidated nano-diamond butadiene grinding disc of the invention is high in processing efficiency; in the grinding process of the consolidated nano-diamond butadiene, the utilization rate of grinding materials is high, the cost is low and the pollution to environment is low; and after the grinding of the consolidated nano-diamond butadiene grinding disc, the grinding materials cannot be embedded into the surface of a processed workpiece, and the subsequent cleaning and processing of the workpiece are conveniently carried out.
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Description

technical field

[0001] The invention belongs to the technical field of grinding and polishing, and in particular relates to a novel consolidated nanodiamondene grinding disc and a preparation process thereof. Background technique

[0002] Since the beginning of the 21st century, the information industry represented by the IC industry has entered a stage of rapid development, and the characteristic line width of IC chips has also entered the nanometer level from the micron level. At present, the characteristic line width of IC chips is only 22 nm, and the wafer size It has also entered the era of 300mm and 400mm, and has developed to a larger size to meet the needs of increasing the output of IC chips. The surface state of the surface will directly affect the linewidth capacity of the device. At present, chemical mechanical grinding and polishing technology is used to planarize the surface of IC chips, while traditional chemical mechanical grinding and polishing uses silicon...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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